TechnischeꢀInformationꢀ/ꢀTechnicalꢀInformation
IGBT-Module
IGBT-modules
FZ800R12KS4_B2
HochleistungsmodulꢀmitꢀAlSiCꢀBodenplatteꢀundꢀschnellemꢀIGBT2ꢀfürꢀhochfrequentesꢀSchaltenꢀ
HighꢀPowerꢀModuleꢀwithꢀAlSiCꢀbaseꢀplateꢀandꢀshortꢀtailꢀIGBT2ꢀforꢀhighꢀswitchingꢀfrequencyꢀ
IGBT,Wechselrichterꢀ/ꢀIGBT,Inverter
HöchstzulässigeꢀWerteꢀ/ꢀMaximumꢀRatedꢀValues
Kollektor-Emitter-Sperrspannung
Tvj = 25°C
VCES
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
1200
ꢀ
ꢀ
ꢀ
V
Collector-emitterꢀvoltage
Kollektor-Dauergleichstrom
ContinuousꢀDCꢀcollectorꢀcurrent
TC = 80°C, Tvj max = 150°C
TC = 25°C, Tvj max = 150°C
IC nom
IC
800
1200
A
A
PeriodischerꢀKollektor-Spitzenstrom
Repetitiveꢀpeakꢀcollectorꢀcurrent
tP = 1 ms
ICRM
Ptot
1600
7,60
A
Gesamt-Verlustleistung
Totalꢀpowerꢀdissipation
TC = 25°C, Tvj max = 150°C
ꢀ kW
Gate-Emitter-Spitzenspannung
Gate-emitterꢀpeakꢀvoltage
ꢀ
VGES
+/-20
ꢀ
V
CharakteristischeꢀWerteꢀ/ꢀCharacteristicꢀValues
min. typ. max.
Kollektor-Emitter-Sättigungsspannung
Collector-emitterꢀsaturationꢀvoltage
IC = 800 A, VGE = 15 V
IC = 800 A, VGE = 15 V
Tvj = 25°C
Tvj = 125°C
3,20 3,70
3,85
V
V
VCE sat
VGEth
QG
Gate-Schwellenspannung
Gateꢀthresholdꢀvoltage
IC = 32,0 mA, VCE = VGE, Tvj = 25°C
VGE = -15 V ... +15 V, VCE = 600V
Tvj = 25°C
4,5
5,5
8,40
0,56
52,0
3,40
ꢀ
6,5
V
µC
Ω
Gateladung
Gateꢀcharge
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
InternerꢀGatewiderstand
Internalꢀgateꢀresistor
RGint
Cies
Eingangskapazität
Inputꢀcapacitance
f = 1 MHz, Tvj = 25°C, VCE = 25 V, VGE = 0 V
f = 1 MHz, Tvj = 25°C, VCE = 25 V, VGE = 0 V
VCE = 1200 V, VGE = 0 V, Tvj = 25°C
VCE = 0 V, VGE = 20 V, Tvj = 25°C
nF
nF
Rückwirkungskapazität
Reverseꢀtransferꢀcapacitance
Cres
ICES
IGES
td on
Kollektor-Emitter-Reststrom
Collector-emitterꢀcut-offꢀcurrent
5,0 mA
Gate-Emitter-Reststrom
Gate-emitterꢀleakageꢀcurrent
ꢀ
400 nA
µs
Einschaltverzögerungszeit,ꢀinduktiveꢀLast
Turn-onꢀdelayꢀtime,ꢀinductiveꢀload
IC = 800 A, VCE = 600 V
VGE = ±15 V
RGon = 1,3 Ω
Tvj = 25°C
Tvj = 125°C
0,10
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
0,125
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
µs
Anstiegszeit,ꢀinduktiveꢀLast
Riseꢀtime,ꢀinductiveꢀload
IC = 800 A, VCE = 600 V
VGE = ±15 V
RGon = 1,3 Ω
Tvj = 25°C
Tvj = 125°C
0,09
0,10
µs
µs
tr
td off
tf
Abschaltverzögerungszeit,ꢀinduktiveꢀLast
Turn-offꢀdelayꢀtime,ꢀinductiveꢀload
IC = 800 A, VCE = 600 V
VGE = ±15 V
RGoff = 1,3 Ω
Tvj = 25°C
Tvj = 125°C
0,53
0,59
µs
µs
Fallzeit,ꢀinduktiveꢀLast
Fallꢀtime,ꢀinductiveꢀload
IC = 800 A, VCE = 600 V
VGE = ±15 V
RGoff = 1,3 Ω
Tvj = 25°C
Tvj = 125°C
0,06
0,07
µs
µs
EinschaltverlustenergieꢀproꢀPuls
Turn-onꢀenergyꢀlossꢀperꢀpulse
IC = 800 A, VCE = 600 V, LS = 60 nH
VGE = ±15 V
RGon = 1,3 Ω
Tvj = 25°C
Tvj = 125°C
mJ
mJ
Eon
Eoff
76,0
58,0
AbschaltverlustenergieꢀproꢀPuls
Turn-offꢀenergyꢀlossꢀperꢀpulse
IC = 800 A, VCE = 600 V, LS = 60 nH
VGE = ±15 V
RGoff = 1,3 Ω
Tvj = 25°C
Tvj = 125°C
mJ
mJ
ꢀ
ꢀ
Kurzschlußverhalten
SCꢀdata
VGE ≤ 15 V, VCC = 900 V
VCEmax = VCES -LsCE ·di/dt
ISC
ꢀ
tP ≤ 10 µs, Tvj = 125°C
6000
A
Wärmewiderstand,ꢀChipꢀbisꢀGehäuse
Thermalꢀresistance,ꢀjunctionꢀtoꢀcase
proꢀIGBTꢀ/ꢀperꢀIGBT
RthJC
RthCH
Tvj op
ꢀ
ꢀ
ꢀ
16,5 K/kW
K/kW
Wärmewiderstand,ꢀGehäuseꢀbisꢀKühlkörper proꢀIGBTꢀ/ꢀperꢀIGBT
Thermalꢀresistance,ꢀcaseꢀtoꢀheatsink
13,5
λ
Pasteꢀ=ꢀ1ꢀW/(m·K)ꢀꢀꢀ/ꢀꢀꢀꢀλgreaseꢀ=ꢀ1ꢀW/(m·K)
TemperaturꢀimꢀSchaltbetrieb
Temperatureꢀunderꢀswitchingꢀconditions
ꢀ
-40
ꢀ
125
°C
preparedꢀby:ꢀWB
approvedꢀby:ꢀPL
dateꢀofꢀpublication:ꢀ2013-11-25
revision:ꢀ3.2
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