April 2000
TM
QFET
FQB4N60 / FQI4N60
600V N-Channel MOSFET
General Description
Features
These N-Channel enhancement mode power field effect
transistors are produced using Fairchild’s proprietary,
planar stripe, DMOS technology.
This advanced technology has been especially tailored to
minimize on-state resistance, provide superior switching
performance, and withstand high energy pulse in the
avalanche and commutation mode. These devices are well
suited for high efficiency switch mode power supply.
•
•
•
•
•
•
4.4A, 600V, R
= 2.2Ω @V = 10 V
DS(on) GS
Low gate charge ( typical 15 nC)
Low Crss ( typical 8.0 pF)
Fast switching
100% avalanche tested
Improved dv/dt capability
D
!
D
"
! "
"
"
G
!
G
S
D2-PAK
FQB Series
I2-PAK
FQI Series
G
D
S
!
S
Absolute Maximum Ratings
ꢀꢀ
T = 25°C unless otherwise noted
C
Symbol
Parameter
FQB4N60 / FQI4N60
Units
V
V
I
Drain-Source Voltage
600
4.4
DSS
- Continuous (T = 25°C)
Drain Current
A
D
C
- Continuous (T = 100°C)
2.8
A
C
I
(Note 1)
Drain Current
- Pulsed
17.6
±ꢀ30
260
A
DM
V
E
I
Gate-Source Voltage
V
GSS
(Note 2)
(Note 1)
(Note 1)
(Note 3)
Single Pulsed Avalanche Energy
Avalanche Current
mJ
A
AS
4.4
AR
E
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
10.6
4.5
mJ
V/ns
W
AR
dv/dt
Power Dissipation (T = 25°C) *
3.13
106
P
A
D
Power Dissipation (T = 25°C)
W
C
- Derate above 25°C
Operating and Storage Temperature Range
0.6
W/°C
°C
T , T
-55 to +150
J
STG
Maximum lead temperature for soldering purposes,
T
300
°C
L
1/8ꢀ from case for 5 seconds
Thermal Characteristics
Symbol
Parameter
Typ
--
Max
Units
°CꢁW
°CꢁW
°CꢁW
R
R
R
Thermal Resistance, Junction-to-Case
Thermal Resistance, Junction-to-Ambient *
Thermal Resistance, Junction-to-Ambient
1.18
40
θ
θ
θ
JC
JA
JA
--
--
62.5
* When mounted on the minimum pad size recommended (PCB Mount)
©2000 Fairchild Semiconductor International
Rev. A, April 2000