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FDA59N30 PDF预览

FDA59N30

更新时间: 2024-11-20 10:32:07
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD /
页数 文件大小 规格书
8页 691K
描述
300V N-Channel MOSFET

FDA59N30 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Transferred零件包装代码:TO-3PN
包装说明:FLANGE MOUNT, R-PSFM-T3针数:3
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8541.29.00.95风险等级:3.89
其他特性:FAST SWITCHING雪崩能效等级(Eas):1734 mJ
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:300 V
最大漏极电流 (Abs) (ID):59 A最大漏极电流 (ID):59 A
最大漏源导通电阻:0.056 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-PSFM-T3JESD-609代码:e3
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:FLANGE MOUNT峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):500 W
最大脉冲漏极电流 (IDM):236 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:NO
端子面层:Matte Tin (Sn)端子形式:THROUGH-HOLE
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

FDA59N30 数据手册

 浏览型号FDA59N30的Datasheet PDF文件第2页浏览型号FDA59N30的Datasheet PDF文件第3页浏览型号FDA59N30的Datasheet PDF文件第4页浏览型号FDA59N30的Datasheet PDF文件第5页浏览型号FDA59N30的Datasheet PDF文件第6页浏览型号FDA59N30的Datasheet PDF文件第7页 
TM  
UniFET  
FDA59N30  
300V N-Channel MOSFET  
Features  
Description  
59A, 300V, R  
Low gate charge ( typical 77 nC)  
= 0.056@V = 10 V  
These N-Channel enhancement mode power field effect transis-  
tors are produced using Fairchild’s proprietary, planar stripe,  
DMOS technology.  
DS(on)  
GS  
Low C ( typical 80 pF)  
rss  
This advanced technology has been especially tailored to mini-  
mize on-state resistance, provide superior switching perfor-  
mance, and withstand high energy pulse in the avalanche and  
commutation mode. These devices are well suited for high effi-  
cient switched mode power supplies and active power factor  
correction.  
Fast switching  
100% avalanche tested  
Improved dv/dt capability  
D
!
"
! "  
"
G
!
"
!
S
TO-3P  
FDA Series  
G D S  
Absolute Maximum Ratings  
Symbol  
Parameter  
FDA59N30  
Unit  
V
Drain-Source Voltage  
Drain Current  
300  
V
DSS  
I
- Continuous (T = 25°C)  
59  
35  
A
A
D
C
- Continuous (T = 100°C)  
C
(Note 1)  
(Note 2)  
I
Drain Current  
- Pulsed  
236  
±30  
1734  
59  
A
V
DM  
V
E
Gate-Source voltage  
GSS  
Single Pulsed Avalanche Energy  
Avalanche Current  
mJ  
A
AS  
I
(Note 1)  
(Note 1)  
(Note 3)  
AR  
E
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
50  
mJ  
V/ns  
AR  
dv/dt  
4.5  
P
Power Dissipation  
(T = 25°C)  
500  
4
W
W/°C  
D
C
- Derate above 25°C  
T
T
T
Operating and Storage Temperature Range  
-55 to +150  
°C  
J, STG  
Maximum Lead Temperature for Soldering Purpose,  
1/8” from Case for 5 Seconds  
L
300  
°C  
Thermal Characteristics  
Symbol  
Parameter  
Min.  
Max.  
0.25  
--  
Unit  
°C/W  
°C/W  
°C/W  
R
R
R
Thermal Resistance, Junction-to-Case  
Thermal Resistance, Case-to-Sink  
--  
0.24  
--  
θJC  
θCS  
θJA  
Thermal Resistance, Junction-to-Ambient  
40  
©2005 Fairchild Semiconductor Corporation  
FDA59N30 Rev. A  
1
www.fairchildsemi.com  

FDA59N30 替代型号

型号 品牌 替代类型 描述 数据表
STW75NF30 STMICROELECTRONICS

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