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EK-42693-01 PDF预览

EK-42693-01

更新时间: 2022-04-23 23:00:11
品牌 Logo 应用领域
PSEMI 开关
页数 文件大小 规格书
4页 99K
描述
SP9T UltraCMOS 2.75 V Switch 100 - 3000 MHz, +68 dBm IIP3

EK-42693-01 数据手册

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Product Brief  
PE42693 DIE  
SP9T UltraCMOS™ 2.75 V Switch  
100 – 3000 MHz, +68 dBm IIP3  
Figure 1. Functional Diagram  
Features  
Two GSM/PCS/EDGE compliant TX  
ports, three TRX ports (WCDMA band or  
receive), and four RX ports  
TRX3 WCDMA  
WCDMA TRX1  
WCDMA TRX2  
GSM/EDGE TX1  
GSM/EDGE TX2  
Four pin CMOS logic control with  
integral decoder/driver  
RX1  
RX2  
RX3  
RX4  
Exceptional harmonic performance:  
2fo = -87 dBc and 3fo = -76 dBc  
Low TRX insertion loss: 0.7 dB at  
900 MHz, 0.9 dB at 1900 MHz  
TX – RX Isolation of 51 dB at 900 MHz,  
45 dB at 1900 MHz  
1500 V HBM ESD tolerance all ports  
+68 dBm IIP3 @ 50  
CMOS  
Control Driver  
and ESD  
-110 dBm IMD3  
V4 V3 V2 V1  
No blocking capacitors required  
Figure 2. Die Top View  
Product Description  
1
26  
TRX3  
TRX1  
27  
28  
29  
30  
31  
ANT  
The PE42693 is a HaRP™-enhanced SP9T RF  
Switch developed on the UltraCMOS™ process  
technology. It addresses the specific design  
needs of the Quad-Band GSM Handset  
Antenna Switch Module Market for use in GSM/  
PCS/EDGE/DCS/WCDMA handsets. The  
switch is comprised of two transmit ports that  
can be used for GSM/PCS/EDGE, three  
2
GND  
RX1  
25  
24  
GND  
TRX2  
3
ANT  
ANT  
4
5
GND  
RX2  
GND 23  
6
7
GND  
RX3  
22  
TX1  
8
9
GND  
RX4  
ANT  
ANT  
21  
GND  
20  
TX2  
10  
GND  
transmit/receive ports (TRX1, TRX2 and TRX3)  
that can be used for either WCDMA or as  
receive ports, and four symmetric receive ports.  
An on-chip CMOS decode logic facilitates four-  
pin low voltage CMOS control. High ESD  
tolerance of 1500 V at all ports, no blocking  
capacitor requirements, and on-chip SAW filter  
over-voltage protection devices make this the  
ultimate in integration and ruggedness.  
19  
GND  
17  
18  
15  
12  
16  
14 13  
11  
Note: Redundant antenna pads for flexible impedance matching  
Figure 3. Package Type: Wirebond Die  
Peregrine’s HaRP™ technology enhancements  
deliver high linearity and exceptional harmonics  
performance. It is an innovative feature of the  
UltraCMOS™ process, providing performance  
superior to GaAs with the economy and  
integration of conventional CMOS.  
Document No. 70-0231-01 www.psemi.com  
©2007 Peregrine Semiconductor Corp. All rights reserved.  
Contact sales@psemi.com for full version of datasheet  
Page 1 of 4  

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