Datasheet > EK55

EK55

更新时间： 2024-12-01 03:34:03

品牌	Logo	应用领域
APEX		/
页数	文件大小	规格书
2页	271K
描述
EVALUATION KIT FOR PA62DK

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中文翻译

获取价格

数据手册

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EK55 数据手册

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INTRODUCTION

BEFORE YOU GET STARTED

Fast and easy breadboarding of circuits using the PA62DK

is possible with the EK55 evaluation kit. The EK55 includes

both the universal EVAL36 board and the EVAL55 substrate.

The use of EVAL36 and EVAL55 allows for a large area of

breadboarding space to work with while allowing a surface

mountsubstrateforthePA62DK.ThePA62DKampliﬁermaybe

surfacemounteddirectlytotheEVAL55,athermallyconductive

but electrically isolated substrate. The PA62DK is soldered to

a DUT foil footprint area the size of the heatslug as shown in

Figure 1. The metal substrate is cost effective and can allow

the PA62DK to dissipate power up to the datasheet rating.

•

All Apex ampliﬁers should be handled using ESD precau-

tion.

Review the Apex product datasheet and operating condi-

tions.

Always provide the appropriate heat sinking. Power dis-

sipation must be considered to ensure maximum junction

temperature (T_J) is not exceeded.

•

Alwaysuseadequatepowersupplybypasscapacitors,Apex

recommends at least 10µF per amp of output current.

Do not change connections while the circuit is powered

In case -Vs is disconnected before +Vs, a diode between

-Vs and ground is recommended to avoid damage.

Initially set all power supplies to the minimum operating

levels allowed in the product datasheet.

•

Part#

EVAL36

EVAL55

Description

Universal PC Board

Evaluation substrate, PA62DK

Quantity

•

Check for oscillations up to and above the unity gain band-

width of the ampliﬁer.

TSM-116-01-T-SV Terminal Strip, 16 PIN

SSW-116-01-T-S Socket Strip, 16 PIN

PCE2055CT-ND

OX7R105KWN

*031606

CAP, 47uF, 50V

ASSEMBLY

Cap, 200V, 1uF, Ceramic

5V, 10mA, 3.4°C/W

heatsink with fan, AAVID

The PA62DK is a surface mount device and should be

assembled to the EVAL55 substrate using surface mount

processes. Solder paste may be dispensed or screen-printed

on the DUT pads. The heat slug on the back of the PA62DK

providesmaximumheatdissipationcapabilitieswhensoldered

to the foil footprint area. The PA62DK should be reﬂowed

to the substrate using a solder reﬂow furnace. If this is not

available, a heat plate capable of solder reﬂow temperatures

may be used.

* Parts are not supplied. Parts are application dependant.

Suggested part numbers are provided.

Figure 1

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Once the ampliﬁer is mounted on the top

ofthesubstrate, theheatsinkfanorselected

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heat sink can then be mounted to the back

of the substrate. A heat sink is not supplied

with the kit, but several options are available

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through AAVID Thermal Product, Inc. High

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thermal conductive thermal grease should

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be used when mounting the heat sink fan or

heat sink to the evaluation board.

Review Figure 2 on next page for other

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possible assembly methods to construct this

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evaluation kit.

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NOTE: All grounds must be tied together

on the EVAL36 board.

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APEX MICROTECHNOLOGY CORPORATION • TELEPHONE (520) 690-8600 • FAX (520) 888-3329 • ORDERS (520) 690-8601 • EMAIL prodlit@apexmicrotech.com

中文翻译

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与EK55相关器件

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EK56	APEX	获取价格	EVALUATION KIT FOR MSA 260KC PINOUT
EK57	APEX	获取价格	EVALUATION KIT FOR MP108FD & MP111FD PINUOT
EK59	APEX	获取价格	EVALUATION KIT MP38CL & MP9
EK5A	YEASHIN	获取价格	SURFACE MOUNT SUPERFAST RECTIFIER VOLTAGE - 50 to 600 Volts CURRENT - 5.0 Ampere
EK5B	YEASHIN	获取价格	SURFACE MOUNT SUPERFAST RECTIFIER VOLTAGE - 50 to 600 Volts CURRENT - 5.0 Ampere
EK5C	YEASHIN	获取价格	SURFACE MOUNT SUPERFAST RECTIFIER VOLTAGE - 50 to 600 Volts CURRENT - 5.0 Ampere
EK5D	YEASHIN	获取价格	SURFACE MOUNT SUPERFAST RECTIFIER VOLTAGE - 50 to 600 Volts CURRENT - 5.0 Ampere
EK5E	YEASHIN	获取价格	SURFACE MOUNT SUPERFAST RECTIFIER VOLTAGE - 50 to 600 Volts CURRENT - 5.0 Ampere
EK5G	YEASHIN	获取价格	SURFACE MOUNT SUPERFAST RECTIFIER VOLTAGE - 50 to 600 Volts CURRENT - 5.0 Ampere
EK5J	YEASHIN	获取价格	SURFACE MOUNT SUPERFAST RECTIFIER VOLTAGE - 50 to 600 Volts CURRENT - 5.0 Ampere

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