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EK60 PDF预览

EK60

更新时间: 2022-04-23 23:00:11
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APEX /
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3页 414K
描述
EVALUATION KIT FOR PA78 PIN-OUT

EK60 数据手册

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INTRODUCTION  
ASSEMBLY  
The EK60 evaluation kit is designed to provide a convenient  
way to breadboard design ideas for the PA78EU power opera-  
tional amplifiers. The EVAL60 evaluation board is pre-wired for  
all required and recommended external components including  
the ones for power supply bypassing, compensation and cur-  
rent limiting. The EVAL60 also includes a breadboard area for  
constructing your application circuit with provisions for a pre-  
amplifier to drive the PA78 inputs.  
During assembly refer to Figure 1 and Figure 2.  
1. Solder surface mount ceramic capacitors C4 and C5 on the  
DUT side of the board.  
2. Addcomponentsforcompensation(CC-,CC+,RC-andRC+)  
based on the closed loop gain and capacitive load. Add the  
current limit resistor (RLIM) based on load requirements (a  
minimum value of 4.5 ohms should be used to protect the  
PA78 internal output devices). It is recommended to use  
MSO2 sockets for the components for quick component  
changes on the board. Add 33pF capacitor (CT) between  
DUT pins 3 and 5.  
3. While developing your application circuit you will probably  
want to use the mating socket strip. Use the MS11 socket  
strip for mounting the PA78 EU. Clip off the strip after the  
12th position. Insert the strip into the circuit board on the  
DUT side and solder one pin on the reverse side. Check  
whether the mating socket strip is fully seated against the  
circuit board and then solder the remaining pins. Insert the  
amplifier fully into the socket strip, noting the pin 1 location  
on the amplifier and the circuit board.  
PARTS LIST  
Apex Part #  
HS27  
EVAL60  
TW12  
OX7R105KWN 1 uF Cap 3530B105K501N  
Novacap, 200V Breakdown  
140-500N5-330J 33pF Cap CDR-500N5-330KS  
XICON  
146510CJ  
MS02  
MS11  
Description  
Heatsink, Apex  
PC Board, Apex  
Thermal Washer, Apex  
Quantity  
1
1
1 Box  
2
1
4. For high power applications (see PA78EU datasheet for  
SOA considerations) mount the heat sink (HS27) in the  
outlined area on the circuit board.  
BNC Connector  
Socket Strip  
Socket Strip  
3
1 bag  
1 bag  
5. If a heat sink is used, position the thermal washer behind  
the amplifier in such a way that the hole on the washer  
coincides with the hole on the tab and the heat sink.  
6. For high slew rate performance connect the heat tab to  
a stable reference (see PA78U datasheet for details).  
7. InstallthebananajacksforP1(+Vs), P2(-Vs)andP3(GND)  
as shown in figure 1 and 2. There are provisions for two  
extra banana jacks (P4 and P5) and can be used if desired  
for external connections.  
EK60 SCHEMATIC  
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APEX MICROTECHNOLOGY CORPORATION • TELEPHONE (520) 690-8600 • FAX (520) 888-3329 • ORDERS (520) 690-8601 • EMAIL prodlit@apexmicrotech.com  
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