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INTRODUCTION
BEFORE YOU GET STARTED
Fast and easy breadboarding of circuits using the PA60DK
is possible with the EK54 evaluation kit. The EK54 includes
both the universal EVAL36 board and the EVAL46 substrate.
The use of EVAL36 and EVAL46 allows for a large area of
breadboarding space to work with while allowing a surface
mountsubstrateforthePA60DK.ThePA60DKamplifiermaybe
surfacemounteddirectlytotheEVAL46,athermallyconductive
but electrically isolated substrate. The PA60DK is soldered to
a DUT foil footprint area the size of the heatslug as shown in
Figure 1. The metal substrate is cost effective and can allow
the PA60DK to dissipate power up to the datasheet rating.
•
•
•
All Apex amplifiers should be handled using ESD precau-
tion.
Review the Apex product datasheet and operating condi-
tions.
Always provide the appropriate heat sinking. Power dis-
sipation must be considered to ensure maximum junction
temperature (TJ) is not exceeded.
•
Alwaysuseadequatepowersupplybypasscapacitors,Apex
recommends at least 10µF per amp of output current.
Do not change connections while the circuit is powered
In case -Vs is disconnected before +Vs, a diode between
-Vs and ground is recommended to avoid damage.
Initially set all power supplies to the minimum operating
levels allowed in the product datasheet.
•
•
Part#
EVAL36
EVAL46
Description
Universal PC Board
Evaluation substrate, PA60DK
Quantity
•
•
1
1
2
2
2
2
Check for oscillations up to and above the unity gain band-
width of the amplifier.
TSM-116-01-T-SV Terminal Strip, 16 PIN
SSW-116-01-T-S Socket Strip, 16 PIN
PCE2055CT-ND CAP, 47uF, 50V
OX7R105KWN
*031606
ASSEMBLY
Cap, 200V, 1uF, Ceramic
5V, 10mA, 3.4°C/W
heatsink with fan, AAVID
The PA60DK is a surface mount device and should be
assembled to the EVAL46 substrate using surface mount
processes. Solder paste may be dispensed or screen-printed
on the DUT pads. The heat slug on the back of the PA60DK
providesmaximumheatdissipationcapabilitieswhensoldered
to the foil footprint area. The PA60DK should be reflowed
to the substrate using a solder reflow furnace. If this is not
available, a heat plate capable of solder reflow temperatures
may be used.
1
* Parts are not supplied. Parts are application dependant.
Suggested part numbers are provided.
Figure 1
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Once the amplifier is mounted on the
top of the substrate, the heat sink fan or
selected heat sink can then be mounted
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to the back of the substrate. A heat sink
is not supplied with the kit, but several
options are available through AAVID
Thermal Product, Inc. High thermal con-
ductive thermal grease should be used
when mounting the heat sink fan or heat
sink to the evaluation board.
Review Figure 2 on next page for other
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possible assembly methods to construct
this evaluation kit.
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APEX MICROTECHNOLOGY CORPORATION • TELEPHONE (520) 690-8600 • FAX (520) 888-3329 • ORDERS (520) 690-8601 • EMAIL prodlit@apexmicrotech.com
1
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