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EBE52UD6ABSA-5C-E PDF预览

EBE52UD6ABSA-5C-E

更新时间: 2024-11-06 22:12:47
品牌 Logo 应用领域
尔必达 - ELPIDA 动态存储器双倍数据速率
页数 文件大小 规格书
21页 228K
描述
512MB DDR2 SDRAM SO-DIMM (64M words x 64 bits, 2 Ranks)

EBE52UD6ABSA-5C-E 数据手册

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DATA SHEET  
512MB DDR2 SDRAM SO-DIMM  
EBE52UD6ABSA (64M words × 64 bits, 2 Ranks)  
Description  
Features  
The EBE52UD6ABSA is 64M words × 64 bits, 2 ranks  
DDR2 SDRAM Small Outline Dual In-line Memory  
Module, mounting 8 pieces of 512M bits DDR2  
SDRAM sealed in FBGA (µBGA) package. Read and  
write operations are performed at the cross points of  
the CK and the /CK. This high-speed data transfer is  
realized by the 4 bits prefetch-pipelined architecture.  
Data strobe (DQS and /DQS) both for read and write  
are available for high speed and reliable data bus  
design. By setting extended mode register, the on-chip  
Delay Locked Loop (DLL) can be set enable or disable.  
This module provides high density mounting without  
200-pin socket type small outline dual in line memory  
module (SO-DIMM)  
PCB height: 30.0mm  
Lead pitch: 0.6mm  
Lead-free  
1.8V power supply  
Data rate: 533Mbps/400Mbps (max.)  
1.8V (SSTL_18 compatible) I/O  
Double-data-rate architecture: two data transfers per  
clock cycle  
Bi-directional, differential data strobe (DQS and  
/DQS) is transmitted/received with data, to be used in  
capturing data at the receiver  
utilizing surface mount technology.  
Decoupling  
capacitors are mounted beside each FBGA (µBGA) on  
the module board.  
DQS is edge aligned with data for READs: center-  
aligned with data for WRITEs  
Note: Do not push the components or drop the  
modules in order to avoid mechanical defects,  
which may result in electrical defects.  
Differential clock inputs (CK and /CK)  
DLL aligns DQ and DQS transitions with CK  
transitions  
Commands entered on each positive CK edge: data  
and data mask referenced to both edges of DQS  
Four internal banks for concurrent operation  
(Component)  
Data mask (DM) for write data  
Burst lengths: 4, 8  
/CAS Latency (CL): 3, 4, 5  
Auto precharge operation for each burst access  
Auto refresh and self refresh modes  
7.8µs average periodic refresh interval  
Posted CAS by programmable additive latency for  
better command and data bus efficiency  
Off-Chip-Driver Impedance Adjustment and On-Die-  
Termination for better signal quality  
/DQS can be disabled for single-ended Data Strobe  
operation.  
Document No. E0418E30 (Ver. 3.0)  
Date Published June 2004 (K) Japan  
URL: http://www.elpida.com  
Elpida Memory, Inc. 2003-2004  

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