Datasheet > E28.6A-S

E28.6A-S

更新时间： 2022-11-24 21:43:57

品牌	Logo	应用领域
英特矽尔 - INTERSIL		/
页数	文件大小	规格书
1页	13K
描述
Plastic Packages for Integrated Circuits

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E28.6A-S 数据手册

Plastic Packages for Integrated Circuits

Dual-In-Line Plastic Packages (PDIP)

E28.6A-S

28 LEAD DUAL-IN-LINE PLASTIC PACKAGE

INDEX

AREA

INCHES MILLIMETERS

1 2

N/2

SYMBOL

MIN

MAX

0.196

MIN

4.5

MAX

5.0

NOTES

0.178

0.020

0.016

0.042

0.008

1.485

0.508

0.50

0.40

1.05

0.20

BASE

0.023

0.053

0.13

0.60

1.35

0.35

PLANE

SEATING

PLANE

e_A

1.503

0.523

37.7

38.2

13.3

2.54 BSC

12.9

0.100 BSC

0.600 BSC

0.119

15.24 BSC

NOTES:

3.0

1. Controlling Dimensions: MILLIMETER. In case of conflict be-

tween English and Metric dimensions, the metric dimensions

control.

2. Dimensions A, A1 and L are measured with the package seated

Rev. 1 4/95

in JEDEC seating plane gauge GS-3.

3. D and E1 dimensions do not include mold flash or protrusions.

is measured with the leads constrained to be perpendicular

to base plane.

5. N is the maximum number of terminal positions.

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