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DM2200J-12I PDF预览

DM2200J-12I

更新时间: 2024-02-10 00:04:02
品牌 Logo 应用领域
铁电 - RAMTRON 动态存储器静态存储器光电二极管内存集成电路
页数 文件大小 规格书
18页 150K
描述
Cache DRAM, 4MX1, 30ns, MOS, PDSO28, 0.300 INCH, PLASTIC, SOJ-28

DM2200J-12I 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:SOJ包装说明:SOJ, SOJ28,.34
针数:28Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8542.32.00.02
风险等级:5.92Is Samacsys:N
访问模式:FAST PAGE/STATIC COLUMN最长访问时间:30 ns
其他特性:RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; 2K X 1 SRAMI/O 类型:SEPARATE
JESD-30 代码:R-PDSO-J28JESD-609代码:e0
内存密度:4194304 bit内存集成电路类型:CACHE DRAM
内存宽度:1功能数量:1
端口数量:1端子数量:28
字数:4194304 words字数代码:4000000
工作模式:ASYNCHRONOUS最高工作温度:85 °C
最低工作温度:-40 °C组织:4MX1
输出特性:3-STATE封装主体材料:PLASTIC/EPOXY
封装代码:SOJ封装等效代码:SOJ28,.34
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
电源:5 V认证状态:Not Qualified
刷新周期:1024自我刷新:NO
最大待机电流:0.001 A子类别:DRAMs
最大压摆率:0.225 mA最大供电电压 (Vsup):5.25 V
最小供电电压 (Vsup):4.75 V标称供电电压 (Vsup):5 V
表面贴装:YES技术:MOS
温度等级:INDUSTRIAL端子面层:Tin/Lead (Sn/Pb)
端子形式:J BEND端子节距:1.27 mm
端子位置:DUALBase Number Matches:1

DM2200J-12I 数据手册

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writes. Memory writes do not affect the contents of the cache row clocked to latch the column address. In page mode, data valid  
register except during a cache hit.  
time is determined by either tAC or tCQV.  
By integrating the SRAM cache as row registers in the DRAM  
array and keeping the on-chip control simple, the EDRAM is able  
to provide superior performance over standard slow 4Mb DRAMs.  
By eliminating the need for SRAMs and cache controllers, system  
cost, board space, and power can all be reduced.  
DRAM Read Miss  
A DRAM read request is initiated by clocking /RE with W/R low  
and /F & /CAL high. The EDRAM compares the new row address to  
the LRR address latch (an 11-bit latch loaded on each /RE active  
read miss cycle). If the row address does not match the LRR, the  
requested data is not in SRAM cache and a new row must be  
fetched from the DRAM. The EDRAM will load the new row data  
into the SRAM cache and update the LRR latch. The data at the  
specified column address is available at the output pins at the  
greater of times tRAC, tAC, and tGQV. It is possible to bring /RE high  
after time tRE since the new row data is safely latched into SRAM  
cache. This allows the EDRAM to precharge the DRAM array while  
data is accessed from SRAM cache. It is possible to access additional  
SRAM cache locations by providing new column addresses to the  
multiplex address inputs. New data is available at the output at time  
tAC after each column address change. During read cycles, it is  
possible to operate in either static column mode with /CAL=high or  
page mode with /CAL clocked to latch the column address. In page  
Functional Description  
The EDRAM is designed to provide optimum memory  
performance with high speed microprocessors. As a result, it is  
possible to perform simultaneous operations to the DRAM and SRAM  
cache sections of the EDRAM. This feature allows the EDRAM to hide  
precharge and refresh operation during SRAM cache reads and  
maximize SRAM cache hit rate by maintaining valid cache contents  
during write operations even if data is written to another memory  
page. These new functions, in conjunction with the faster basic DRAM  
and cache speeds of the EDRAM, minimize processor wait states.  
EDRAM Basic Operating Modes  
mode, data valid time is determined by either tAC or tCQV  
DRAM Write Hit  
If a DRAM write request is initiated by clocking /RE while W/R,  
.
The EDRAM operating modes are specified in the table below.  
Hit and Miss Terminology  
In this datasheet, “hit” and “miss” always refer to a hit or miss  
to the page of data contained in the SRAM cache row register. This  
is always equal to the contents of the last row that was read from  
(as modified by any write hit data). Writing to a new page does not  
cause the cache to be modified.  
/CAL, /WE, and /F are high, the EDRAM will compare the new row  
address to the LRR address latch (an 11-bit address latch loaded  
on each /RE active read miss cycle). If the row address matches,  
the EDRAM will write data to both the DRAM array and selected  
SRAM cache simultaneously to maintain coherency. The write  
address and data are posted to the DRAM as soon as the column  
address is latched by bringing /CAL low and the write data is  
latched by bringing /WE low. The write address and data can be  
latched very quickly after the fall of /RE (tRAH + tASC for the column  
address and tDS for the data). During a write burst sequence, the  
second write data can be posted at time tRSW after /RE. Subsequent  
writes within a page can occur with write cycle time tPC. With /G  
enabled and /WE disabled, it is possible to perform cache read  
operations while the /RE is activated in write hit mode. This allows  
read-modify-write, write-verify, or random read-write sequences  
within the page with 12ns cycle times (the first read cannot  
complete until after time tRAC2). At the end of a write sequence  
(after /CAL and /WE are brought high and tRE is satisfied), /RE can  
be brought high to precharge the memory. It is possible to perform  
DRAM Read Hit  
A DRAM read request is initiated by clocking /RE with W/R low  
and /F & /CAL high. The EDRAM compares the new row address to  
the last row read address latch (LRR - an 11-bit latch loaded on  
each /RE active read miss cycle). If the row address matches the  
LRR, the requested data is already in the SRAM cache and no  
DRAM memory reference is initiated. The data specified by the  
column address is available at the output pins at the greater of  
times tAC or tGQV. Since no DRAM activity is initiated, /RE can be  
brought high after time tRE1, and a shorter precharge time, tRP1, is  
allowed. It is possible to access additional SRAM cache locations by  
providing new column addresses to the multiplex address inputs.  
New data is available at the output at time tAC after each column  
address change. During read cycles, it is possible to operate in  
either static column mode with /CAL=high or page mode with /CAL  
EDRAM Basic Operating Modes  
Function  
/S  
L
L
L
L
X
/RE  
W/R  
L
/F  
H
H
H
H
L
/CAL /WE  
A
Comment  
0-10  
Read Hit  
H
H
H
H
X
X
X
H
H
X
Row = LRR  
Row LRR  
Row = LRR  
Row LRR  
X
No DRAM Reference, Data in Cache  
DRAM Row to Cache  
Read Miss  
Write Hit  
L
H
Write to DRAM and Cache, Reads Enabled  
Write to DRAM, Cache Not Updated, Reads Disabled  
Cache Reads Enabled  
Write Miss  
Internal Refresh  
H
X
Low Power Standby  
Unallowed Mode  
H
H
H
H
L
X
X
H
X
H
H
H
X
L
H
X
H
X
X
X
1mA Standby Current  
Unallowed Mode (Except -L Option)  
Standby Current, Internal Refresh Clock (-L Option)  
Low Power Self-Refresh  
Option  
H = High; L = Low; X = Don’t Care; = High-to-Low Transition; LRR = Last Row Read  
1-2  

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