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CYW88335L2CUBG PDF预览

CYW88335L2CUBG

更新时间: 2024-11-18 01:20:23
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 电信电信集成电路
页数 文件大小 规格书
110页 2073K
描述
Single-Chip 5G Wi-Fi IEEE 802.11ac MAC/Baseband/Radiowith Integrated Bluetooth 4.1 for Automotive Applications

CYW88335L2CUBG 技术参数

生命周期:Active包装说明:VFBGA,
Reach Compliance Code:compliant风险等级:5.69
JESD-30 代码:R-PBGA-B145长度:5.413 mm
功能数量:1端子数量:145
最高工作温度:85 °C最低工作温度:-40 °C
封装主体材料:PLASTIC/EPOXY封装代码:VFBGA
封装形状:RECTANGULAR封装形式:GRID ARRAY, VERY THIN PROFILE, FINE PITCH
筛选级别:AEC-Q100座面最大高度:0.55 mm
标称供电电压:1.2 V表面贴装:YES
电信集成电路类型:TELECOM CIRCUIT温度等级:INDUSTRIAL
端子形式:BALL端子节距:0.4 mm
端子位置:BOTTOM宽度:4.87 mm
Base Number Matches:1

CYW88335L2CUBG 数据手册

 浏览型号CYW88335L2CUBG的Datasheet PDF文件第2页浏览型号CYW88335L2CUBG的Datasheet PDF文件第3页浏览型号CYW88335L2CUBG的Datasheet PDF文件第4页浏览型号CYW88335L2CUBG的Datasheet PDF文件第5页浏览型号CYW88335L2CUBG的Datasheet PDF文件第6页浏览型号CYW88335L2CUBG的Datasheet PDF文件第7页 
CYW88335  
Single-Chip 5G Wi-Fi IEEE 802.11ac MAC/Baseband/Radio  
with Integrated Bluetooth 4.1 for Automotive Applications  
The Cypress CYW88335 single-chip device provides the highest level of integration for Automotive In-Vehicle Infotainment connec-  
tivity systems with integrated single-stream IEEE 802.11ac MAC/baseband/radio, Bluetooth 4.1. In IEEE 802.11ac mode, the WLAN  
operation supports rates of MCS0–MCS9 (up to 256 QAM) in 20 MHz, 40 MHz, and 80 MHz channels for data rates up to 433.3 Mbps.  
In addition, all the rates specified in IEEE 802.11a/b/g/n are supported. Included on-chip are 2.4 GHz and 5 GHz transmit amplifiers,  
and receive low-noise amplifiers. Optional external PAs, LNAs, and antenna diversity are also supported.  
The CYW88335 offers an SDIO v3.0 interface for high speed 802.11ac connectivity. The Bluetooth host controller is interfaced over  
a 4-wire high speed UART and includes PCM for audio.  
The CYW88335 brings the latest mobile connectivity technology to automotive infotainment, telematics and rear seat entertainment.  
Offering Automotive Grade 3 (–40°C to +85°C) temperature performance, the CYW88335 is tested to AECQ100 environmental stress  
guidelines and manufactured in ISO9001 and TS16949 certified facilities.  
The CYW88335 implements highly sophisticated enhanced collaborative coexistence hardware mechanisms and algorithms, which  
ensure that WLAN and Bluetooth collaboration is optimized for maximum performance. In addition, coexistence support for external  
radios (such as LTE cellular, GPS, and WiMAX) is provided via an external interface. As a result, enhanced overall quality for  
simultaneous voice, video, and data transmission is achieved.  
Cypress Part Numbering Scheme  
Cypress is converting the acquired IoT part numbers from Broadcom to the Cypress part numbering scheme. Due to this conversion,  
there is no change in form, fit, or function as a result of offering the device with Cypress part number marking. The table provides  
Cypress ordering part number that matches an existing IoT part number.  
Table 1. Mapping Table for Part Number between Broadcom and Cypress  
Broadcom Part Number  
Cypress Part Number  
BCM88335  
CYW88335  
BCM88335L2CUBG  
CYW88335L2CUBG  
Acronyms and Abbreviations  
In most cases, acronyms and abbreviations are defined on first use.  
For a comprehensive list of acronyms and other terms used in Cypress documents, go to http://www.cypress.com/glossary.  
Features  
IEEE 802.11x Key Features  
IEEE 802.11ac compliant.  
Internal fractional nPLL allows support for a wide range of  
reference clock frequencies  
Single-stream spatial multiplexing up to 433.3 Mbps data rate.  
Supports IEEE 802.15.2 external coexistence interface to  
optimize bandwidth utilization with other co-located wireless  
technologies such as LTE, GPS, or WiMAX  
Supports 20, 40, and 80 MHz channels with optional SGI (256  
QAM modulation).  
Full IEEE 802.11a/b/g/n legacy compatibility with enhanced  
Supports standard SDIO v3.0 (including DDR50 mode at  
50 MHz and SDR104 mode at 208 MHz, 4-bit and 1-bit), and  
gSPI (48 MHz) host interfaces.  
performance.  
TX and RX low-density parity check (LDPC) support for  
improved range and power efficiency.  
Backward compatible with SDIO v2.0 host interfaces.  
Integrated ARMCR4processor with tightly coupled memory  
for complete WLAN subsystem functionality, minimizing the  
needtowakeuptheapplicationsprocessorforstandardWLAN  
functions. This allows for further minimization of power  
consumption, while maintaining the ability to field upgrade with  
future features. On-chip memory includes 768 KB SRAM and  
640 KB ROM.  
OneDriversoftware architecture for easy migration from  
existing embedded WLAN and Bluetooth devices as well as  
future devices.  
Supports RX space-time block coding (STBC)  
Supports IEEE 802.11ac/n beamforming.  
On-chip power amplifiers and low-noise amplifiers for both  
bands.  
Supportforoptionalfront-endmodules(FEM)withexternalPAs  
and LNAs  
Shared Bluetooth and WLAN receive signal path eliminates the  
need for an external power splitter while maintaining excellent  
sensitivity for both Bluetooth and WLAN.  
Cypress Semiconductor Corporation  
Document Number: 002-15057 Rev. *B  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised May 8, 2017  

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