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CYK128K16SCCBU-55BVXI PDF预览

CYK128K16SCCBU-55BVXI

更新时间: 2024-11-27 21:13:47
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 内存集成电路
页数 文件大小 规格书
10页 244K
描述
Pseudo Static RAM, 128KX16, 55ns, CMOS, PBGA48, 6 X 8 MM, 1 MM HEIGHT, VFBGA-48

CYK128K16SCCBU-55BVXI 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:BGA包装说明:VFBGA,
针数:48Reach Compliance Code:unknown
ECCN代码:3A991.B.2.AHTS代码:8542.32.00.41
风险等级:5.84最长访问时间:55 ns
JESD-30 代码:R-PBGA-B48JESD-609代码:e1
长度:8 mm内存密度:2097152 bit
内存集成电路类型:PSEUDO STATIC RAM内存宽度:16
功能数量:1端子数量:48
字数:131072 words字数代码:128000
工作模式:ASYNCHRONOUS最高工作温度:85 °C
最低工作温度:-25 °C组织:128KX16
封装主体材料:PLASTIC/EPOXY封装代码:VFBGA
封装形状:RECTANGULAR封装形式:GRID ARRAY, VERY THIN PROFILE, FINE PITCH
并行/串行:PARALLEL峰值回流温度(摄氏度):260
认证状态:Not Qualified座面最大高度:1 mm
最大供电电压 (Vsup):3.3 V最小供电电压 (Vsup):2.7 V
标称供电电压 (Vsup):3 V表面贴装:YES
技术:CMOS温度等级:OTHER
端子面层:TIN SILVER COPPER端子形式:BALL
端子节距:0.75 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:20宽度:6 mm
Base Number Matches:1

CYK128K16SCCBU-55BVXI 数据手册

 浏览型号CYK128K16SCCBU-55BVXI的Datasheet PDF文件第2页浏览型号CYK128K16SCCBU-55BVXI的Datasheet PDF文件第3页浏览型号CYK128K16SCCBU-55BVXI的Datasheet PDF文件第4页浏览型号CYK128K16SCCBU-55BVXI的Datasheet PDF文件第5页浏览型号CYK128K16SCCBU-55BVXI的Datasheet PDF文件第6页浏览型号CYK128K16SCCBU-55BVXI的Datasheet PDF文件第7页 
CYK128K16SCCB  
2-Mbit (128K x 16) Pseudo Static RAM  
Features  
Functional Description[1]  
• Advanced low power MoBL® architecture  
• High speed: 55ns, 70ns  
• Wide voltage range: 2.7V to 3.3V  
• Typical active current: 1mA @ f = 1 MHz  
• Low standby power  
The CYK128K16SCCB is a high-performance CMOS pseudo  
static RAMs (PSRAM) organized as 128K words by 16 bits that  
supports an asynchronous memory interface. This device  
features advanced circuit design to provide ultra-low active  
current. This is ideal for providing More Battery Life(MoBL)  
in portable applications such as cellular telephones. The  
device can be put into standby mode reducing power  
consumption dramatically when deselected (CE1 LOW, CE2  
HIGH or both BHE and BLE are HIGH). The input/output pins  
(I/O0 through I/O15) are placed in a high-impedance state  
when the chip is deselected (CE1 HIGH, CE2 LOW) or OE is  
deasserted HIGH), or during a write operation (Chip Enabled  
and Write Enable WE LOW). Reading from the device is  
accomplished by asserting the Chip Enables (CE1 LOW and  
CE2 HIGH) and Output Enable (OE) LOW while forcing the  
Write Enable (WE) HIGH. If Byte Low Enable (BLE) is LOW,  
then data from the memory location specified by the address  
pins will appear on I/O0 to I/O7. If Byte High Enable (BHE) is  
LOW, then data from memory will appear on I/O8 to I/O15. See  
the Truth Table for a complete description of read and write  
modes.  
• Automatic power-down when deselected  
Logic Block Diagram  
DATA IN DRIVERS  
A10  
A9  
A8  
A7  
A6  
A5  
A4  
A3  
A2  
A1  
A0  
128K x 16  
RAM Array  
I/O0–I/O7  
I/O8–I/O15  
COLUMN DECODER  
BHE  
WE  
CE2  
CE1  
OE  
BLE  
CE2  
CE1  
Power -Down  
Circuit  
BHE  
BLE  
Note:  
1. For best-practice recommendations, please refer to the Cypress application note “System Design Guidelines” on http://www.cypress.com.  
Cypress Semiconductor Corporation  
3901 North First Street  
San Jose, CA 95134  
408-943-2600  
Document #: 38-05525 Rev. *E  
Revised September 28, 2004  

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