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CY7C2565KV18-500BZI PDF预览

CY7C2565KV18-500BZI

更新时间: 2024-11-05 06:51:47
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 存储内存集成电路静态存储器时钟
页数 文件大小 规格书
29页 824K
描述
72-Mbit QDR-II+ SRAM 4-Word Burst Architecture

CY7C2565KV18-500BZI 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:BGA包装说明:13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165
针数:165Reach Compliance Code:not_compliant
ECCN代码:3A991.B.2.AHTS代码:8542.32.00.41
Factory Lead Time:1 week风险等级:5.77
Is Samacsys:N最长访问时间:0.45 ns
其他特性:PIPELINED ARCHITECTURE最大时钟频率 (fCLK):500 MHz
I/O 类型:SEPARATEJESD-30 代码:R-PBGA-B165
长度:15 mm内存密度:75497472 bit
内存集成电路类型:QDR SRAM内存宽度:36
功能数量:1端子数量:165
字数:2097152 words字数代码:2000000
工作模式:SYNCHRONOUS最高工作温度:85 °C
最低工作温度:-40 °C组织:2MX36
输出特性:3-STATE封装主体材料:PLASTIC/EPOXY
封装代码:LBGA封装等效代码:BGA165,11X15,40
封装形状:RECTANGULAR封装形式:GRID ARRAY, LOW PROFILE
并行/串行:PARALLEL电源:1.5/1.8,1.8 V
认证状态:Not Qualified座面最大高度:1.4 mm
最大待机电流:0.36 A最小待机电流:1.7 V
子类别:SRAMs最大压摆率:1.21 mA
最大供电电压 (Vsup):1.9 V最小供电电压 (Vsup):1.7 V
标称供电电压 (Vsup):1.8 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子形式:BALL端子节距:1 mm
端子位置:BOTTOM宽度:13 mm
Base Number Matches:1

CY7C2565KV18-500BZI 数据手册

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CY7C2561KV18, CY7C2576KV18  
CY7C2563KV18, CY7C2565KV18  
PRELIMINARY  
72-Mbit QDR™-II+ SRAM 4-Word Burst  
Architecture (2.5 Cycle Read Latency) with ODT  
Features  
Configurations  
Separate independent read and write data ports  
Supports concurrent transactions  
With Read Cycle Latency of 2.5 cycles:  
CY7C2561KV18 – 8M x 8  
550 MHz clock for high bandwidth  
CY7C2576KV18 – 8M x 9  
CY7C2563KV18 – 4M x 18  
CY7C2565KV18 – 2M x 36  
4-word burst for reducing address bus frequency  
Double Data Rate (DDR) interfaces on both read and write  
ports (data transferred at 1100 MHz) at 550 MHz  
Functional Description  
Available in 2.5 clock cycle latency  
The CY7C2561KV18, CY7C2576KV18, CY7C2563KV18, and  
CY7C2565KV18 are 1.8V Synchronous Pipelined SRAMs,  
equipped with QDR-II+ architecture. Similar to QDR-II archi-  
tecture, QDR-II+ architecture consists of two separate ports: the  
read port and the write port to access the memory array. The  
read port has dedicated data outputs to support read operations  
and the write port has dedicated data inputs to support write  
operations. QDR-II+ architecture has separate data inputs and  
data outputs to completely eliminate the need to “turn-around”  
the data bus that exists with common IO devices. Each port is  
accessed through a common address bus. Addresses for read  
and write addresses are latched on alternate rising edges of the  
input (K) clock. Accesses to the QDR-II+ read and write ports are  
completely independent of one another. To maximize data  
throughput, both read and write ports are equipped with DDR  
interfaces. Each address location is associated with four 8-bit  
words (CY7C2561KV18), 9-bit words (CY7C2576KV18), 18-bit  
words (CY7C2563KV18), or 36-bit words (CY7C2565KV18) that  
burst sequentially into or out of the device. Because data is trans-  
ferred into and out of the device on every rising edge of both input  
clocks (K and K), memory bandwidth is maximized while simpli-  
fying system design by eliminating bus “turn-arounds”.  
Two input clocks (K and K) for precise DDR timing  
SRAM uses rising edges only  
Echo clocks (CQ and CQ) simplify data capture in high-speed  
systems  
Data valid pin (QVLD) to indicate valid data on the output  
On-Die Termination (ODT) feature  
Supported for D[x:0], BWS[x:0], and K/K inputs  
Single multiplexed address input bus latches address inputs  
for read and write ports  
Separate port selects for depth expansion  
Synchronous internally self-timed writes  
QDR™-II+ operates with 2.5 cycle read latency when DOFF is  
asserted HIGH  
Operates similar to QDR-I device with 1 cycle read latency  
when DOFF is asserted LOW  
Available in x8, x9, x18, and x36 configurations  
Full data coherency, providing most current data  
These devices have an On-Die Termination feature supported  
for D[x:0], BWS[x:0], and K/K inputs, which helps eliminate  
external termination resistors, reduce cost, reduce board area,  
and simplify board routing.  
[1]  
Core VDD = 1.8V± 0.1V; IO VDDQ = 1.4V to VDD  
Supports both 1.5V and 1.8V IO supply  
Depth expansion is accomplished with port selects, which  
enables each port to operate independently.  
HSTL inputs and variable drive HSTL output buffers  
Available in 165-Ball FBGA package (13 x 15 x 1.4 mm)  
Offered in both Pb-free and non Pb-free packages  
JTAG 1149.1 compatible test access port  
All synchronous inputs pass through input registers controlled by  
the K or K input clocks. All data outputs pass through output  
registers controlled by the K or K input clocks. Writes are  
conducted with on-chip synchronous self-timed write circuitry.  
Phase Locked Loop (PLL) for accurate data placement  
Table 1. Selection Guide  
Description  
Maximum Operating Frequency  
Maximum Operating Current  
550 MHz  
500 MHz  
500  
450 MHz  
450  
400 MHz  
400  
Unit  
MHz  
mA  
550  
900  
900  
920  
x8  
x9  
830  
760  
690  
830  
760  
690  
x18  
x36  
850  
780  
710  
1310  
1210  
1100  
1000  
Note  
1. The Cypress QDR-II+ devices surpass the QDR consortium specification and can support V  
= 1.4V to V  
.
DD  
DDQ  
Cypress Semiconductor Corporation  
Document Number: 001-15887 Rev. *E  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised April 24, 2009  
[+] Feedback  

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