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CY7C1480BV33-200AXC PDF预览

CY7C1480BV33-200AXC

更新时间: 2024-11-24 15:17:23
品牌 Logo 应用领域
英飞凌 - INFINEON 静态存储器
页数 文件大小 规格书
34页 980K
描述
Synchronous SRAM

CY7C1480BV33-200AXC 数据手册

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CY7C1480BV33  
CY7C1482BV33  
72-Mbit (2M × 36/4M × 18)  
Pipelined Sync SRAM  
72-Mbit (2M  
× 36/4M × 18) Pipelined Sync SRAM  
Features  
Functional Description  
Supports bus operation up to 250 MHz  
Available speed grades are 250, 200, and 167 MHz  
Registered inputs and outputs for pipelined operation  
3.3 V core power supply  
The CY7C1480BV33 and CY7C1482BV33 SRAM integrates  
2M × 36/4M × 18 SRAM cells with advanced synchronous  
peripheral circuitry and a 2-bit counter for internal burst  
operation. All synchronous inputs are gated by registers  
controlled by a positive-edge-triggered Clock Input (CLK). The  
synchronous inputs include all addresses, all data inputs,  
address-pipelining Chip Enable (CE1), depth-expansion Chip  
Enables (CE2 and CE3), Burst Control inputs (ADSC, ADSP, and  
ADV), Write Enables (BWX, and BWE), and Global Write (GW).  
Asynchronous inputs include the Output Enable (OE) and the ZZ  
pin.  
2.5 V/3.3 V I/O operation  
Fast clock-to-output times  
3.0 ns (for 250 MHz device)  
Provide high performance 3-1-1-1 access rate  
Addresses and chip enables are registered at the rising edge of  
the clock when either address strobe processor (ADSP) or  
Address Strobe Controller (ADSC) are active. Subsequent burst  
addresses may be internally generated as controlled by the  
advance pin (ADV).  
User selectable burst counter supporting Intel® Pentium®  
interleaved or linear burst sequences  
Separate processor and controller address strobes  
Synchronous self timed writes  
Address, data inputs, and write controls are registered on-chip  
to initiate a self timed write cycle.This part supports byte write  
operations (see sections Pin Definitions on page 6 and Truth  
Table on page 9 for further details). Write cycles can be one to  
two or four bytes wide as controlled by the byte write control  
inputs. GW when active LOW causes all bytes to be written.  
Asynchronous output enable  
Single cycle chip deselect  
CY7C1480BV33 available in JEDEC-standard Pb-free 100-pin  
thin quad flat pack (TQFP), Pb-free and non Pb-free 165-ball  
fine-pitch ball grid array (FBGA) package. CY7C1482BV33  
available in non Pb-free 165-ball fine-pitch ball grid array  
(FBGA) package  
The CY7C1480BV33 and CY7C1482BV33 operates from a  
+3.3 V core power supply while all outputs may operate with  
either a +2.5 or +3.3 V supply. All inputs and outputs are JEDEC  
standard  
JESD8-5  
compatible.  
For  
best  
practices  
IEEE 1149.1 JTAG-compatible boundary scan  
“ZZ” sleep mode option  
recommendations, refer to the Cypress application note AN1064  
“SRAM System Guidelines”.  
For a complete list of related documentation, click here.  
Selection Guide  
Description  
Maximum access time  
250 MHz  
3.0  
200 MHz  
3.0  
167 MHz Unit  
3.4  
450  
120  
ns  
Maximum operating current  
500  
500  
mA  
mA  
Maximum CMOS standby current  
120  
120  
Cypress Semiconductor Corporation  
Document Number: 001-15145 Rev. *L  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised February 15, 2018  

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