5秒后页面跳转
捷配首页

Datasheet > 存储 > SRAM> CY7C1480V25-200BZI
CY7C1480V25-200BZI PDF预览

CY7C1480V25-200BZI

更新时间： 2024-11-26 05:19:43
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 存储内存集成电路静态存储器时钟
页数 文件大小 规格书
32页 1304K
描述
72-Mbit (2M x 36/4M x 18/1M x 72) Pipelined Sync SRAM

阅读下载

中文翻译

获取价格

CY7C1480V25-200BZI 技术参数

是否Rohs认证： 不符合生命周期：Obsolete
零件包装代码：BGA包装说明：15 X 17 MM, 1.40 MM HEIGHT, FBGA-165
针数：165Reach Compliance Code：not_compliant
ECCN代码：3A991.B.2.AHTS代码：8542.32.00.41
风险等级：5.9Is Samacsys：N
最长访问时间：3 ns其他特性：PIPELINED ARCHITECTURE
最大时钟频率 (fCLK)：200 MHzI/O 类型：COMMON
JESD-30 代码：R-PBGA-B165JESD-609代码：e0
长度：17 mm内存密度：75497472 bit
内存集成电路类型：CACHE SRAM内存宽度：36
湿度敏感等级：3功能数量：1
端子数量：165字数：2097152 words
字数代码：2000000工作模式：SYNCHRONOUS
最高工作温度：85 °C最低工作温度：-40 °C
组织：2MX36输出特性：3-STATE
封装主体材料：PLASTIC/EPOXY封装代码：LBGA
封装等效代码：BGA165,11X15,40封装形状：RECTANGULAR
封装形式：GRID ARRAY, LOW PROFILE并行/串行：PARALLEL
峰值回流温度（摄氏度）：220电源：2.5 V
认证状态：Not Qualified座面最大高度：1.4 mm
最小待机电流：2.38 V子类别：SRAMs
最大供电电压 (Vsup)：2.625 V最小供电电压 (Vsup)：2.375 V
标称供电电压 (Vsup)：2.5 V表面贴装：YES
技术：CMOS温度等级：INDUSTRIAL
端子面层：TIN LEAD端子形式：BALL
端子节距：1 mm端子位置：BOTTOM
处于峰值回流温度下的最长时间：NOT SPECIFIED宽度：15 mm
Base Number Matches：1

CY7C1480V25-200BZI 数据手册

 浏览型号CY7C1480V25-200BZI的Datasheet PDF文件第2页浏览型号CY7C1480V25-200BZI的Datasheet PDF文件第3页浏览型号CY7C1480V25-200BZI的Datasheet PDF文件第4页浏览型号CY7C1480V25-200BZI的Datasheet PDF文件第5页浏览型号CY7C1480V25-200BZI的Datasheet PDF文件第6页浏览型号CY7C1480V25-200BZI的Datasheet PDF文件第7页 
CY7C1480V25  
CY7C1482V25  
CY7C1486V25  
72-Mbit (2M x 36/4M x 18/1M x 72)  
Pipelined Sync SRAM  
Features  
Functional Description[1]  
• Supports bus operation up to 250 MHz  
• Available speed grades are 250, 200, and 167 MHz  
• Registered inputs and outputs for pipelined operation  
• 2.5V core power supply  
The CY7C1480V25/CY7C1482V25/CY7C1486V25 SRAM  
integrates 2M x 36/4M x 18/1M × 72 SRAM cells with  
advanced synchronous peripheral circuitry and a two-bit  
counter for internal burst operation. All synchronous inputs are  
gated by registers controlled by a positive-edge-triggered  
Clock Input (CLK). The synchronous inputs include all  
addresses, all data inputs, address-pipelining Chip Enable  
(CE1), depth-expansion Chip Enables (CE2 and CE3), Burst  
Control inputs (ADSC, ADSP, and ADV), Write Enables (BWX,  
and BWE), and Global Write (GW). Asynchronous inputs  
include the Output Enable (OE) and the ZZ pin.  
• 2.5V/1.8V IO operation  
• Fast clock-to-output time  
— 3.0 ns (for 250-MHz device)  
• Provide high-performance 3-1-1-1 access rate  
• User selectable burst counter supporting Intel®  
Pentium® interleaved or linear burst sequences  
Addresses and chip enables are registered at rising edge of  
clock when either Address Strobe Processor (ADSP) or  
Address Strobe Controller (ADSC) is active. Subsequent burst  
addresses can be internally generated as controlled by the  
Advance pin (ADV).  
• Separate processor and controller address strobes  
• Synchronous self timed writes  
• Asynchronous output enable  
• Single cycle chip deselect  
Address, data inputs, and write controls are registered on-chip  
to initiate a self-timed Write cycle. This part supports Byte  
Write operations (see “Pin Definitions” on page 7 and “Truth  
Table” on page 10 for further details). Write cycles can be one  
to two or four bytes wide, as controlled by the byte write control  
inputs. When it is active LOW, GW causes all bytes to be  
written.  
• CY7C1480V25, CY7C1482V25 available in  
JEDEC-standard Pb-free 100-pin TQFP, Pb-free and  
non-Pb-free 165-ball FBGA package. CY7C1486V25  
available in Pb-free and non-Pb-free 209-ball FBGA  
package  
• IEEE 1149.1 JTAG-Compatible Boundary Scan  
• “ZZ” Sleep Mode option  
The CY7C1480V25/CY7C1482V25/CY7C1486V25 operates  
from a +2.5V core power supply while all outputs may operate  
with either a +2.5 or +1.8V supply. All inputs and outputs are  
JEDEC-standard JESD8-5-compatible.  
Selection Guide  
250 MHz  
3.0  
200 MHz  
3.0  
167 MHz  
3.4  
Unit  
ns  
Maximum Access Time  
Maximum Operating Current  
Maximum CMOS Standby Current  
450  
450  
400  
mA  
mA  
120  
120  
120  
Note  
1. For best practices recommendations, refer to the Cypress application note System Design Guidelines at www.cypress.com.  
Cypress Semiconductor Corporation  
Document #: 38-05282 Rev. *H  
•
198 Champion Court  
•
San Jose, CA 95134-1709  
•
408-943-2600  
Revised April 23, 2007  
[+] Feedback  
1234567...32

中文翻译

下载PDF

与CY7C1480V25-200BZI相关器件

型号 品牌 获取价格 描述 数据表
CY7C1480V25-200BZXC CYPRESS

获取价格

 		72-Mbit (2M x 36/4M x 18/1M x 72) Pipelined Sync SRAM
CY7C1480V25-200BZXI CYPRESS

获取价格

 		72-Mbit (2M x 36/4M x 18/1M x 72) Pipelined Sync SRAM
CY7C1480V25-250AXC CYPRESS

获取价格

 		72-Mbit (2M x 36/4M x 18/1M x 72) Pipelined Sync SRAM
CY7C1480V25-250AXI CYPRESS

获取价格

 		72-Mbit (2M x 36/4M x 18/1M x 72) Pipelined Sync SRAM
CY7C1480V25-250BZC CYPRESS

获取价格

 		72-Mbit (2M x 36/4M x 18/1M x 72) Pipelined Sync SRAM
CY7C1480V25-250BZI CYPRESS

获取价格

 		72-Mbit (2M x 36/4M x 18/1M x 72) Pipelined Sync SRAM
CY7C1480V25-250BZXC CYPRESS

获取价格

 		72-Mbit (2M x 36/4M x 18/1M x 72) Pipelined Sync SRAM
CY7C1480V25-250BZXI CYPRESS

获取价格

 		72-Mbit (2M x 36/4M x 18/1M x 72) Pipelined Sync SRAM
CY7C1480V33 CYPRESS

获取价格

 		72-Mbit (2M x 36/4M x 18/1M x 72) Pipelined Sync SRAM
CY7C1480V33_06 CYPRESS

获取价格

 		72-Mbit (2M x 36/4M x 18/1M x 72) Pipelined Sync SRAM

与CY7C1480V25-200BZI相关文章

您还可以找


热门产品
PCB打样/小批量
铝基板
BOM智能配单
PCBA制造
钣金
精密CNC
模具注塑
薄膜开关
精选活动
PCBA打样特惠
四六层板品质升级
铝基板品质升级
一体化电子制造
DFM下载
服务支持
企业认证
产品展示
工厂展示
工艺能力
积分商城
关于捷配
捷配简介
企业文化
公司动态
人才招聘
联系我们
帮助中心
下单流程
付款流程
开票流程
常见问题
全球PCB制造服务专线 400-613-0088

工作时间：9:00-21:00

CEO邮箱：ceo@jiepei.com

投诉邮箱：tousu@jiepei.com

捷配网-微信公众号 微信公众号
捷配网-微信公众号 抖音公众号
资质认证：
合作快递：
支付方式：
Copyright © 2024 Jiepei.com Inc. All Rights Reserved. 版权所有:杭州捷配信息科技有限公司 浙公网安备 33010502006866号 浙ICP备10014259号-119 营业执照ICP证