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CY7C1416AV18-200BZC PDF预览

CY7C1416AV18-200BZC

更新时间: 2024-09-13 05:19:27
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赛普拉斯 - CYPRESS 静态存储器双倍数据速率
页数 文件大小 规格书
24页 261K
描述
36-Mbit DDR-II SRAM 2-Word Burst Architecture

CY7C1416AV18-200BZC 数据手册

 浏览型号CY7C1416AV18-200BZC的Datasheet PDF文件第2页浏览型号CY7C1416AV18-200BZC的Datasheet PDF文件第3页浏览型号CY7C1416AV18-200BZC的Datasheet PDF文件第4页浏览型号CY7C1416AV18-200BZC的Datasheet PDF文件第5页浏览型号CY7C1416AV18-200BZC的Datasheet PDF文件第6页浏览型号CY7C1416AV18-200BZC的Datasheet PDF文件第7页 
CY7C1416AV18  
CY7C1427AV18  
CY7C1418AV18  
CY7C1420AV18  
PRELIMINARY  
36-Mbit DDR-II SRAM 2-Word  
Burst Architecture  
Features  
Functional Description  
• 36-Mbit density (4M x 8, 4M x 9, 2M x 18, 1M x 36)  
• 250-MHz clock for high bandwidth  
The CY7C1416AV18, CY7C1427AV18, CY7C1418AV18, and  
CY7C1420AV18 are 1.8V Synchronous Pipelined SRAM  
equipped with DDR-II architecture. The DDR-II consists of an  
SRAM core with advanced synchronous peripheral circuitry  
and a 1-bit burst counter. Addresses for Read and Write are  
latched on alternate rising edges of the input (K) clock. Write  
data is registered on the rising edges of both K and K. Read  
data is driven on the rising edges of C and C if provided, or on  
the rising edge of K and K if C/C are not provided. Each  
address location is associated with two 8-bit words in the case  
of CY7C1416AV18 and two 9-bit words in the case of  
CY7C1427AV18 that burst sequentially into or out of the  
device. The burst counter always starts with a “0” internally in  
the case of CY7C1416AV18 and CY7C1427AV18. On  
CY7C1418AV18 and CY7C1420AV18, the burst counter takes  
in the least significant bit of the external address and bursts  
two 18-bit words in the case of CY7C1418AV18 and two 36-bit  
words in the case of CY7C1420AV18 sequentially into or out  
of the device.  
• 2-Word burst for reducing address bus frequency  
• Double Data Rate (DDR) interfaces  
(data transferred at 500 MHz) @ 250 MHz  
• Two input clocks (K and K) for precise DDR timing  
— SRAM uses rising edges only  
• Two output clocks (C and C) account for clock skew  
and flight time mismatching  
• Echo clocks (CQ and CQ) simplify data capture in  
high-speed systems  
• Synchronous internally self-timed writes  
• 1.8V core power supply with HSTL inputs and outputs  
• Variable drive HSTL output buffers  
• Expanded HSTL output voltage (1.4V–VDD  
)
Asynchronous inputs include impedance match (ZQ).  
Synchronous data outputs (Q, sharing the same physical pins  
as the data inputs D) are tightly matched to the two output echo  
clocks CQ/CQ, eliminating the need for separately capturing  
data from each individual DDR SRAM in the system design.  
Output data clocks (C/C) enable maximum system clocking  
and data synchronization flexibility.  
• 15 x 17 x 1.4 mm 1.0-mm pitch fBGA package,  
165 ball (11x15 matrix)  
• JTAG 1149.1 compatible test access port  
• Delay Lock Loop (DLL) for accurate data placement  
Configurations  
All synchronous inputs pass through input registers controlled  
by the K or K input clocks. All data outputs pass through output  
registers controlled by the C or C input clocks. Writes are  
conducted with on-chip synchronous self-timed write circuitry.  
CY7C1416AV18 – 4M x 8  
CY7C1427AV18 – 4M x 9  
CY7C1418AV18 – 2M x 18  
CY7C1420AV18 – 1M x 36  
Selection Guide  
250 MHz  
250  
200 MHz  
200  
167 MHz  
167  
Unit  
MHz  
mA  
Maximum Operating Frequency  
Maximum Operating Current  
TBD  
TBD  
TBD  
Shaded areas contain advance information.  
Cypress Semiconductor Corporation  
Document Number: 38-05616 Rev. **  
3901 North First Street  
San Jose, CA 95134  
408-943-2600  
Revised July 15, 2004  

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