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CY7C1382D-250BZXC PDF预览

CY7C1382D-250BZXC

更新时间: 2024-10-11 21:53:55
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 静态存储器
页数 文件大小 规格书
29页 468K
描述
18-Mbit (512K x 36/1M x 18) Pipelined SRAM

CY7C1382D-250BZXC 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:BGA包装说明:15 X 13 MM, 1.4 MM HEIGHT, LEAD FREE, MO-216, FBGA-165
针数:165Reach Compliance Code:compliant
ECCN代码:3A991.B.2.AHTS代码:8542.32.00.41
风险等级:5.82最长访问时间:2.6 ns
其他特性:PIPELINED ARCHITECTURE最大时钟频率 (fCLK):250 MHz
I/O 类型:COMMONJESD-30 代码:R-PBGA-B165
JESD-609代码:e1长度:15 mm
内存密度:18874368 bit内存集成电路类型:CACHE SRAM
内存宽度:18湿度敏感等级:3
功能数量:1端子数量:165
字数:1048576 words字数代码:1000000
工作模式:SYNCHRONOUS最高工作温度:70 °C
最低工作温度:组织:1MX18
输出特性:3-STATE封装主体材料:PLASTIC/EPOXY
封装代码:LBGA封装等效代码:BGA165,11X15,40
封装形状:RECTANGULAR封装形式:GRID ARRAY, LOW PROFILE
并行/串行:PARALLEL峰值回流温度(摄氏度):260
电源:2.5/3.3,3.3 V认证状态:Not Qualified
座面最大高度:1.4 mm最大待机电流:0.07 A
最小待机电流:3.14 V子类别:SRAMs
最大压摆率:0.35 mA最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):3.135 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子面层:Tin/Silver/Copper (Sn/Ag/Cu)
端子形式:BALL端子节距:1 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:20
宽度:13 mm

CY7C1382D-250BZXC 数据手册

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CY7C1380D  
CY7C1382D  
PRELIMINARY  
18-Mbit (512K x 36/1M x 18) Pipelined SRAM  
Features  
Functional Description[1]  
• Supports bus operation up to 250 MHz  
• Available speed grades are 250, 200 and 167 MHz  
• Registered inputs and outputs for pipelined operation  
• 3.3V core power supply  
The CY7C1380D/CY7C1382D SRAM integrates 524,288 x 36  
and 1,048,576 x 18 SRAM cells with advanced synchronous  
peripheral circuitry and a two-bit counter for internal burst  
operation. All synchronous inputs are gated by registers  
controlled by a positive-edge-triggered Clock Input (CLK). The  
synchronous inputs include all addresses, all data inputs,  
• 2.5V / 3.3V I/O operation  
• Fast clock-to-output times  
address-pipelining Chip Enable (  
), depth-expansion Chip  
CE1  
[2]  
Enables (CE and  
), Burst Control inputs (  
,
,
CE3  
— 2.6 ns (for 250-MHz device)  
ADSC ADSP  
2
), Write Enables (  
ADV  
, and  
BWX  
), and Global Write  
and  
BWE  
— 3.0 ns (for 200-MHz device)  
(
). Asynchronous inputs include the Output Enable (  
)
OE  
GW  
— 3.4 ns (for 167-MHz device)  
and the ZZ pin.  
• Provide high-performance 3-1-1-1 access rate  
Addresses and chip enables are registered at rising edge of  
clock when either Address Strobe Processor ( ) or  
User-selectable burst counter supporting Intel  
ADSP  
) are active. Subsequent  
Pentium interleaved or linear burst sequences  
Address Strobe Controller (  
ADSC  
burst addresses can be internally generated as controlled by  
the Advance pin ( ).  
• Separate processor and controller address strobes  
• Synchronous self-timed writes  
ADV  
• Asynchronous output enable  
Address, data inputs, and write controls are registered on-chip  
to initiate a self-timed Write cycle.This part supports Byte Write  
operations (see Pin Descriptions and Truth Table for further  
details). Write cycles can be one to two or four bytes wide as  
• Single Cycle Chip Deselect  
• Offered in JEDEC-standard lead-free 100-pin TQFP,  
119-ball BGA and 165-Ball fBGA packages  
controlled by the byte write control inputs.  
when active  
GW  
• IEEE 1149.1 JTAG-Compatible Boundary Scan  
• “ZZ” Sleep Mode Option  
causes all bytes to be written.  
LOW  
The CY7C1380D/CY7C1382D operates from a +3.3V core  
power supply while all outputs may operate with either a +2.5  
or +3.3V supply. All inputs and outputs are JEDEC-standard  
JESD8-5-compatible.  
Selection Guide  
250 MHz  
2.6  
200 MHz  
3.0  
167 MHz  
3.4  
Unit  
ns  
Maximum Access Time  
Maximum Operating Current  
Maximum CMOS Standby Current  
350  
70  
300  
70  
275  
70  
mA  
mA  
Shaded areas contain advance information. Please contact your local Cypress sales representative for availability of these parts.  
Notes:  
1. For best–practices recommendations, please refer to the Cypress application note System Design Guidelines on www.cypress.com.  
2. CE , CE are for TQFP and 165 fBGA package only. 119 BGA is offered only in 1 Chip Enable.  
3
2
Cypress Semiconductor Corporation  
3901 North First Street  
San Jose, CA 95134  
408-943-2600  
Document #: 38-05543 Rev. *A  
Revised October 28, 2004  

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