CY7C1366B
CY7C1367B
9-Mb (256K x 36/512K x 18) Pipelined DCD Sync SRAM
Features
Functional Description[1]
• Supports bus operation up to 225 MHz
The CY7C1366B/CY7C1367B SRAM integrates 262,144 x 36
and 524,288 x 18 SRAM cells with advanced synchronous
peripheral circuitry and a two-bit counter for internal burst
operation. All synchronous inputs are gated by registers
controlled by a positive-edge-triggered Clock Input (CLK). The
synchronous inputs include all addresses, all data inputs,
• Available speed grades are 225, 200 and 166 MHz
• Registered inputs and outputs for pipelined operation
• Optimal for performance (Double-Cycle deselect)
— Depth expansion without wait state
• 3.3V –5% and +10% core power supply (VDD
• 2.5V / 3.3V I/O operation
address-pipelining Chip Enable (
), depth-expansion Chip
CE1
)
Enables (CE and
[2]), Burst Control inputs (
,
,
CE3
2
ADSC ADSP
), Write Enables (
, and
BWX
), and Global Write
and
ADV
BWE
(
). Asynchronous inputs include the Output Enable (
GW
)
OE
• Fast clock-to-output times
and the ZZ pin.
— 2.8 ns (for 225-MHz device)
— 3.0 ns (for 200-MHz device)
— 3.5 ns (for 166-MHz device)
Addresses and chip enables are registered at rising edge of
clock when either Address Strobe Processor ( ) or
ADSP
) are active. Subsequent
Address Strobe Controller (
ADSC
burst addresses can be internally generated as controlled by
the Advance pin ( ).
• Provide high-performance 3-1-1-1 access rate
ADV
• User-selectable burst counter supporting Intel
Address, data inputs, and write controls are registered on-chip
to initiate a self-timed Write cycle.This part supports Byte Write
operations (see Pin Descriptions and Truth Table for further
details). Write cycles can be one to four bytes wide as
Pentium interleaved or linear burst sequences
• Separate processor and controller address strobes
• Synchronous self-timed writes
• Asynchronous output enable
controlled by the byte write control inputs.
active
GW
LOW
This device incorporates an
causes all bytes to be written.
additional pipelined enable register which delays turning off
the output buffers an additional cycle when a deselect is
executed.This feature allows depth expansion without penal-
izing system performance.
• Offered in JEDEC-standard 100-pin TQFP, 119-ball BGA
and 165-Ball fBGA packages
• IEEE 1149.1 JTAG-Compatible Boundary Scan
• “ZZ” Sleep Mode Option
The CY7C1366B/CY7C1367B operates from a +3.3V core
power supply while all outputs operate with a +3.3V or a +2.5V
supply. All inputs and outputs are JEDEC-standard
JESD8-5-compatible.
Selection Guide
225 MHz
200 MHz
3.0
166 MHz
3.5
Unit
ns
mA
mA
Maximum Access Time
Maximum Operating Current
Maximum CMOS Standby Current
2.8
250
30
220
30
180
30
Shaded areas contain advance information. Please contact your local Cypress sales representative for availability of these parts.
Notes:
1. For best–practices recommendations, please refer to the Cypress application note System Design Guidelines on www.cypress.com.
2. CE is for TQFP and 165 fBGA package only. 119 BGA is offered only in 2 Chip Enable.
3
Cypress Semiconductor Corporation
•
3901 North First Street
•
San Jose, CA 95134
•
408-943-2600
Document #: 38-05096 Rev. *B
Revised February 23, 2004