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CY7C1265XV18-633BZXC PDF预览

CY7C1265XV18-633BZXC

更新时间: 2024-04-09 18:58:35
品牌 Logo 应用领域
英飞凌 - INFINEON 静态存储器
页数 文件大小 规格书
31页 1390K
描述
Synchronous SRAM

CY7C1265XV18-633BZXC 数据手册

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CY7C1263XV18  
CY7C1265XV18  
36-Mbit QDR® II+ Xtreme SRAM Four-Word  
Burst Architecture (2.5 Cycle Read Latency)  
36-Mbit QDR® II+ Xtreme SRAM Four-Word Burst Architecture (2.5 Cycle Read Latency)  
Features  
Configurations  
Separate Independent Read and Write Data Ports  
Supports concurrent transactions  
With Read Cycle Latency of 2.5 cycles:  
CY7C1263XV18 – 2 M × 18  
633 MHz Clock for High Bandwidth  
CY7C1265XV18 – 1 M × 36  
Four-word Burst for Reducing Address Bus Frequency  
Functional Description  
Double Data Rate (DDR) Interfaces on both Read and Write  
The CY7C1263XV18, and CY7C1265XV18 are 1.8 V  
Synchronous Pipelined SRAMs, equipped with QDR II+  
architecture. Similar to QDR II architecture, QDR II+ architecture  
consists of two separate ports: the read port and the write port to  
access the memory array. The read port has dedicated data  
outputs to support read operations and the write port has  
dedicated data inputs to support write operations. QDR II+  
architecture has separate data inputs and data outputs to  
completely eliminate the need to “turnaround” the data bus that  
exists with common I/O devices. Each port is accessed through  
a common address bus. Addresses for read and write addresses  
are latched on alternate rising edges of the input (K) clock.  
Accesses to the QDR II+ Xtreme read and write ports are  
completely independent of one another. To maximize data  
throughput, both read and write ports are equipped with DDR  
interfaces. Each address location is associated with four 18-bit  
words (CY7C1263XV18), or 36-bit words (CY7C1265XV18) that  
burst sequentially into or out of the device. Because data is  
transferred into and out of the device on every rising edge of both  
input clocks (K and K), memory bandwidth is maximized while  
simplifying system design by eliminating bus “turnarounds”.  
Ports (data transferred at 1266 MHz) at 633 MHz  
Available in 2.5 Clock Cycle Latency  
Two Input Clocks (K and K) for precise DDR Timing  
SRAM uses rising edges only  
Echo Clocks (CQ and CQ) simplify Data Capture in High Speed  
Systems  
Data Valid Pin (QVLD) to indicate Valid Data on the Output  
Single Multiplexed Address Input Bus latches Address Inputs  
for Read and Write Ports  
Separate Port selects for Depth Expansion  
Synchronous Internally Self-timed Writes  
QDR® II+ Xtreme operates with 2.5 cycle read latency when  
DOFF is asserted HIGH  
Operates similar to QDR I Device with one Cycle Read Latency  
when DOFF is asserted LOW  
Available in × 18 and × 36 Configurations  
Full Data Coherency, providing Most Current Data  
Depth expansion is accomplished with port selects, which  
enables each port to operate independently.  
Core VDD = 1.8 V ± 0.1 V; I/O VDDQ = 1.4 V to 1.6 V  
Supports 1.5 V I/O supply  
All synchronous inputs pass through input registers controlled by  
the K or K input clocks. All data outputs pass through output  
registers controlled by the K or K input clocks. Writes are  
conducted with on-chip synchronous self-timed write circuitry.  
HSTL Inputs and Variable Drive HSTL Output Buffers  
Available in 165-ball FBGA Package (13 × 15 × 1.4 mm)  
Offered in Pb-free Packages  
For a complete list of related documentation, click here.  
JTAG 1149.1 compatible Test Access Port  
Phase-Locked Loop (PLL) for Accurate Data Placement  
Selection Guide  
Description  
Maximum Operating Frequency  
633 MHz  
633  
600 MHz Unit  
600  
1100  
1570  
MHz  
mA  
Maximum Operating Current  
× 18  
× 36  
1165  
1660  
Cypress Semiconductor Corporation  
Document Number: 001-70328 Rev. *F  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised January 3, 2018  

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