Datasheet > 暂无类别数据> CY7C1266V18-333BZXI

CY7C1266V18-333BZXI

更新时间： 2024-02-26 22:46:51

品牌	Logo	应用领域
赛普拉斯 - CYPRESS		静态存储器双倍数据速率
页数	文件大小	规格书
27页	1244K
描述
36-Mbit DDR-II+ SRAM 2-Word Burst Architecture (2.5 Cycle Read Latency)

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CY7C1266V18-333BZXI 技术参数

是否Rohs认证：	符合	生命周期：	Obsolete
零件包装代码：	BGA	包装说明：	LBGA, BGA165,11X15,40
针数：	165	Reach Compliance Code：	compliant
ECCN代码：	3A991.B.2.A	HTS代码：	8542.32.00.41
风险等级：	5.84	最长访问时间：	0.45 ns
其他特性：	PIPELINED ARCHITECTURE	最大时钟频率 (fCLK)：	333 MHz
I/O 类型：	COMMON	JESD-30 代码：	R-PBGA-B165
JESD-609代码：	e1	长度：	17 mm
内存密度：	33554432 bit	内存集成电路类型：	DDR SRAM
内存宽度：	8	湿度敏感等级：	3
功能数量：	1	端子数量：	165
字数：	4194304 words	字数代码：	4000000
工作模式：	SYNCHRONOUS	最高工作温度：	85 °C
最低工作温度：	-40 °C	组织：	4MX8
输出特性：	3-STATE	封装主体材料：	PLASTIC/EPOXY
封装代码：	LBGA	封装等效代码：	BGA165,11X15,40
封装形状：	RECTANGULAR	封装形式：	GRID ARRAY, LOW PROFILE
并行/串行：	PARALLEL	峰值回流温度（摄氏度）：	260
电源：	1.5/1.8,1.8 V	认证状态：	Not Qualified
座面最大高度：	1.4 mm	最大待机电流：	0.3 A
最小待机电流：	1.7 V	子类别：	SRAMs
最大压摆率：	1.08 mA	最大供电电压 (Vsup)：	1.9 V
最小供电电压 (Vsup)：	1.7 V	标称供电电压 (Vsup)：	1.8 V
表面贴装：	YES	技术：	CMOS
温度等级：	INDUSTRIAL	端子面层：	Tin/Silver/Copper (Sn/Ag/Cu)
端子形式：	BALL	端子节距：	1 mm
端子位置：	BOTTOM	处于峰值回流温度下的最长时间：	40
宽度：	15 mm	Base Number Matches：	1

CY7C1266V18-333BZXI 数据手册

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CY7C1266V18

CY7C1277V18

CY7C1268V18

CY7C1270V18

36-Mbit DDR-II+ SRAM 2-Word

Burst Architecture (2.5 Cycle Read Latency)

Functional Description

Features

• 36-Mbit density (4M x 8, 4M x 9, 2M x 18, 1M x 36)

• 300 MHz to 400 MHz clock for high bandwidth

• 2-Word burst for reducing address bus frequency

The CY7C1266V18, CY7C1277V18, CY7C1268V18, and

CY7C1270V18 are 1.8V Synchronous Pipelined SRAMs

equipped with DDR-II+ architecture. The DDR-II+ consists of

an SRAM core with advanced synchronous peripheral

circuitry. Addresses for read and write are latched on alternate

rising edges of the input (K) clock. Write data is registered on

the rising edges of both K and K. Read data is driven on the

rising edges of both K and K. Each address location is

associated with two 8-bit words (CY7C1266V18), 9-bit words

(CY7C1277V18), 18-bit words (CY7C1268V18), or 36-bit

words (CY7C1270V18), that burst sequentially into or out of

the device.

• Double Data Rate (DDR) interfaces

(data transferred at 800 MHz) @ 400 MHz

• Read latency of 2.5 clock cycles

• Two input clocks (K and K) for precise DDR timing

— SRAM uses rising edges only

• Echo clocks (CQ and CQ) simplify data capture in high

speed systems

Asynchronous inputs include output impedance matching

input (ZQ). Synchronous data outputs (Q, sharing the same

physical pins as the data inputs, D) are tightly matched to the

two output echo clocks CQ/CQ, eliminating the need to

capture data separately from each individual DDR SRAM in

the system design.

• Data valid pin (QVLD) to indicate valid data on the output

• Synchronous internally self-timed writes

[1]

• Core V_DD= 1.8V ± 0.1V; IO V_DDQ= 1.4V to V_DD

• HSTL inputs and variable drive HSTL output buffers

• Available in 165-ball FBGA package (15 x 17 x 1.4 mm)

• Offered in both in Pb-free and non Pb-free packages

• JTAG 1149.1 compatible test access port

All synchronous inputs pass through input registers controlled

by the K or K input clocks. All data outputs pass through output

registers controlled by the K or K input clocks. Writes are

conducted with on-chip synchronous self-timed write circuitry.

• Delay Lock Loop (DLL) for accurate data placement

Configurations

With Read Cycle Latency of 2.5 cycles:

CY7C1266V18 – 4M x 8

CY7C1277V18 – 4M x 9

CY7C1268V18 – 2M x 18

CY7C1270V18 – 1M x 36

Selection Guide

400 MHz

400

375 MHz

333 MHz

333

300 MHz

300

Unit

MHz

Maximum Operating Frequency

Maximum Operating Current

375

1280

1210

1080

1000

Note

1. The QDR consortium specification for V

is 1.5V + 0.1V. The Cypress QDR devices exceed the QDR consortium specification and are capable of supporting

DDQ

= 1.4V to V

DDQ

Cypress Semiconductor Corporation

Document Number: 001-06347 Rev. *C

•

198 Champion Court

•

San Jose, CA 95134-1709

•

408-943-2600

Revised May 14, 2007

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与CY7C1266V18-333BZXI相关器件

型号	品牌	描述	获取价格	数据表
CY7C1266V18-375BZC	CYPRESS	36-Mbit DDR-II+ SRAM 2-Word Burst Architecture (2.5 Cycle Read Latency)	获取价格
CY7C1266V18-375BZI	CYPRESS	36-Mbit DDR-II+ SRAM 2-Word Burst Architecture (2.5 Cycle Read Latency)	获取价格
CY7C1266V18-375BZXC	CYPRESS	36-Mbit DDR-II+ SRAM 2-Word Burst Architecture (2.5 Cycle Read Latency)	获取价格
CY7C1266V18-375BZXI	CYPRESS	36-Mbit DDR-II+ SRAM 2-Word Burst Architecture (2.5 Cycle Read Latency)	获取价格
CY7C1266V18-400BZC	CYPRESS	36-Mbit DDR-II+ SRAM 2-Word Burst Architecture (2.5 Cycle Read Latency)	获取价格
CY7C1266V18-400BZI	CYPRESS	36-Mbit DDR-II+ SRAM 2-Word Burst Architecture (2.5 Cycle Read Latency)	获取价格

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