CY62157CV25/30/33
MoBL™
512K x 16 Static RAM
reducing power consumption by more than 99% when dese-
lected (CE1 HIGH or CE2 LOW or both BLE and BHE are
HIGH). The input/output pins (I/O0 through I/O15) are placed
in a high-impedance state when: deselected (CE1 HIGH or
CE2 LOW), outputs are disabled (OE HIGH), both Byte High
Enable and Byte Low Enable are disabled (BHE, BLE HIGH),
or during a write operation (CE1 LOW and CE2 HIGH and WE
LOW).
Features
• High speed
— 55 ns and 70 ns availability
• Voltage range:
— CY62157CV25: 2.2V–2.7V
— CY62157CV30: 2.7V–3.3V
— CY62157CV33: 3.0V–3.6V
• Ultra-low active power
— Typical active current: 1.5 mA @ f = 1 MHz
Writing to the device is accomplished by taking Chip Enable 1
(CE1) and Write Enable (WE) inputs LOW and Chip Enable 2
(CE2) HIGH. If Byte Low Enable (BLE) is LOW, then data from
I/O pins (I/O0 through I/O7), is written into the location speci-
fied on the address pins (A0 through A18). If Byte High Enable
(BHE) is LOW, then data from I/O pins (I/O8 through I/O15) is
written into the location specified on the address pins (A0
through A18).
— Typicalactivecurrent:5.5mA@f=fmax (70nsspeed)
• Low standby power
• Easy memory expansion with CE1, CE2 and OE features
• Automatic power-down when deselected
• CMOS for optimum speed/power
Reading from the device is accomplished by taking Chip
Enable 1 (CE1) and Output Enable (OE) LOW and Chip Enable
2 (CE2) HIGH while forcing the Write Enable (WE) HIGH. If
Byte Low Enable (BLE) is LOW, then data from the memory
location specified by the address pins will appear on I/O0 to
I/O7. If Byte High Enable (BHE) is LOW, then data from mem-
ory will appear on I/O8 to I/O15. See the truth table at the back
of this data sheet for a complete description of read and write
modes.
Functional Description
The CY62157CV25/30/33 are high-performance CMOS static
RAMs organized as 512K words by 16 bits. These devices
feature advanced circuit design to provide ultra-low active cur-
rent. This is ideal for providing More Battery Life™ (MoBL™)
in portable applications such as cellular telephones. The de-
vices also have an automatic power-down feature that signifi-
cantly reduces power consumption by 80% when addresses
are not toggling. The device can also be put into standby mode
The CY62157CV25/30/33 are available in a 48-ball FBGA
package.
Logic Block Diagram
DATA IN DRIVERS
A
A
A
A
A
A
A
A
A
10
9
8
7
6
512K × 16
5
4
3
2
RAM Array
2048 × 4096
I/O –I/O
0
7
I/O –I/O
8
15
A
A
1
0
COLUMN DECODER
BHE
WE
CE
2
CE
1
OE
BLE
Power-down
Circuit
CE
2
BHE
BLE
CE
1
Cypress Semiconductor Corporation
•
3901 North First Street
•
San Jose
•
CA 95134
•
408-943-2600
Document #: 38-05014 Rev. *C
Revised April 23, 2002