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CY62157CV25LL-70BAI PDF预览

CY62157CV25LL-70BAI

更新时间: 2024-11-19 22:18:27
品牌 Logo 应用领域
赛普拉斯 - CYPRESS /
页数 文件大小 规格书
13页 280K
描述
512K x 16 Static RAM

CY62157CV25LL-70BAI 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:BGA包装说明:6 X 10 MM, 1.20 MM HEIGHT, FBGA-48
针数:48Reach Compliance Code:not_compliant
ECCN代码:3A991.B.2.AHTS代码:8542.32.00.41
风险等级:5.75最长访问时间:70 ns
I/O 类型:COMMONJESD-30 代码:R-PBGA-B48
JESD-609代码:e0长度:10 mm
内存密度:8388608 bit内存集成电路类型:STANDARD SRAM
内存宽度:16功能数量:1
端子数量:48字数:524288 words
字数代码:512000工作模式:ASYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:512KX16输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:TFBGA
封装等效代码:BGA48,6X8,30封装形状:RECTANGULAR
封装形式:GRID ARRAY, THIN PROFILE, FINE PITCH并行/串行:PARALLEL
电源:2.5 V认证状态:Not Qualified
座面最大高度:1.2 mm最大待机电流:0.00002 A
最小待机电流:1.5 V子类别:SRAMs
最大压摆率:0.015 mA最大供电电压 (Vsup):2.7 V
最小供电电压 (Vsup):2.2 V标称供电电压 (Vsup):2.5 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:Tin/Lead (Sn/Pb)
端子形式:BALL端子节距:0.75 mm
端子位置:BOTTOM宽度:6 mm
Base Number Matches:1

CY62157CV25LL-70BAI 数据手册

 浏览型号CY62157CV25LL-70BAI的Datasheet PDF文件第2页浏览型号CY62157CV25LL-70BAI的Datasheet PDF文件第3页浏览型号CY62157CV25LL-70BAI的Datasheet PDF文件第4页浏览型号CY62157CV25LL-70BAI的Datasheet PDF文件第5页浏览型号CY62157CV25LL-70BAI的Datasheet PDF文件第6页浏览型号CY62157CV25LL-70BAI的Datasheet PDF文件第7页 
CY62157CV25/30/33  
MoBL™  
512K x 16 Static RAM  
reducing power consumption by more than 99% when dese-  
lected (CE1 HIGH or CE2 LOW or both BLE and BHE are  
HIGH). The input/output pins (I/O0 through I/O15) are placed  
in a high-impedance state when: deselected (CE1 HIGH or  
CE2 LOW), outputs are disabled (OE HIGH), both Byte High  
Enable and Byte Low Enable are disabled (BHE, BLE HIGH),  
or during a write operation (CE1 LOW and CE2 HIGH and WE  
LOW).  
Features  
High speed  
55 ns and 70 ns availability  
Voltage range:  
CY62157CV25: 2.2V2.7V  
CY62157CV30: 2.7V3.3V  
CY62157CV33: 3.0V3.6V  
Ultra-low active power  
Typical active current: 1.5 mA @ f = 1 MHz  
Writing to the device is accomplished by taking Chip Enable 1  
(CE1) and Write Enable (WE) inputs LOW and Chip Enable 2  
(CE2) HIGH. If Byte Low Enable (BLE) is LOW, then data from  
I/O pins (I/O0 through I/O7), is written into the location speci-  
fied on the address pins (A0 through A18). If Byte High Enable  
(BHE) is LOW, then data from I/O pins (I/O8 through I/O15) is  
written into the location specified on the address pins (A0  
through A18).  
Typicalactivecurrent:5.5mA@f=fmax (70nsspeed)  
Low standby power  
Easy memory expansion with CE1, CE2 and OE features  
Automatic power-down when deselected  
CMOS for optimum speed/power  
Reading from the device is accomplished by taking Chip  
Enable 1 (CE1) and Output Enable (OE) LOW and Chip Enable  
2 (CE2) HIGH while forcing the Write Enable (WE) HIGH. If  
Byte Low Enable (BLE) is LOW, then data from the memory  
location specified by the address pins will appear on I/O0 to  
I/O7. If Byte High Enable (BHE) is LOW, then data from mem-  
ory will appear on I/O8 to I/O15. See the truth table at the back  
of this data sheet for a complete description of read and write  
modes.  
Functional Description  
The CY62157CV25/30/33 are high-performance CMOS static  
RAMs organized as 512K words by 16 bits. These devices  
feature advanced circuit design to provide ultra-low active cur-  
rent. This is ideal for providing More Battery Life(MoBL)  
in portable applications such as cellular telephones. The de-  
vices also have an automatic power-down feature that signifi-  
cantly reduces power consumption by 80% when addresses  
are not toggling. The device can also be put into standby mode  
The CY62157CV25/30/33 are available in a 48-ball FBGA  
package.  
Logic Block Diagram  
DATA IN DRIVERS  
A
A
A
A
A
A
A
A
A
10  
9
8
7
6
512K × 16  
5
4
3
2
RAM Array  
2048 × 4096  
I/O I/O  
0
7
I/O I/O  
8
15  
A
A
1
0
COLUMN DECODER  
BHE  
WE  
CE  
2
CE  
1
OE  
BLE  
Power-down  
Circuit  
CE  
2
BHE  
BLE  
CE  
1
Cypress Semiconductor Corporation  
3901 North First Street  
San Jose  
CA 95134  
408-943-2600  
Document #: 38-05014 Rev. *C  
Revised April 23, 2002  

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