CY62136ESL MoBL®
2-Mbit (128 K × 16) Static RAM
2-Mbit (128
K × 16) Static RAM
not toggling. Placing the device into standby mode reduces
power consumption by more than 99% when deselected (CE
HIGH). The input and output pins (I/O0 through I/O15) are placed
in a high impedance state when the device is deselected (CE
HIGH), the outputs are disabled (OE HIGH), both Byte High
Enable and Byte Low Enable are disabled (BHE, BLE HIGH) or
during a write operation (CE LOW and WE LOW).
Features
■ Very high speed: 45 ns
■ Wide voltage range: 2.2 V to 3.6 V and 4.5 V to 5.5 V
■ Ultra low standby power
❐ Typical standby current: 1 A
❐ Maximum standby current: 7 A
To write to the device, take Chip Enable (CE) and Write Enable
(WE) inputs LOW. If Byte Low Enable (BLE) is LOW, then data
from I/O pins (I/O0 through I/O7) is written into the location
specified on the address pins (A0 through A16). If Byte High
Enable (BHE) is LOW, then data from I/O pins (I/O8 through
I/O15) is written into the location specified on the address pins
(A0 through A16).
■ Ultra low active power
❐ Typical active current: 2 mA at f = 1 MHz
■ Easy memory expansion with CE and OE features
■ Automatic power-down when deselected
To read from the device, take Chip Enable (CE) and Output
Enable (OE) LOW while forcing the Write Enable (WE) HIGH. If
Byte Low Enable (BLE) is LOW, then data from the memory
location specified by the address pins appears on I/O0 to I/O7. If
Byte High Enable (BHE) is LOW, then data from memory
appears on I/O8 to I/O15. See the Truth Table on page 11 for a
complete description of read and write modes.
■ Complementary metal oxide semiconductor (CMOS) for
optimum speed and power
■ Available in Pb-free 44-pin thin small outline package (TSOP) II
package
Functional Description
The device is suitable for interfacing with processors that have
TTL I/P levels. It is not suitable for processors that require CMOS
I/P levels. Please see Electrical Characteristics on page 4 for
more details and suggested alternatives.
The CY62136ESL is a high performance CMOS static RAM
organized as 128K words by 16 bits. This device features
advanced circuit design to provide ultra low active current. This
is ideal for providing More Battery Life (MoBL®) in portable
applications. The device also has an automatic power down
feature that reduces power consumption when addresses are
For a complete list of related documentation, click here.
Logic Block Diagram
DATA IN DRIVERS
A10
A9
A8
A7
A6
A5
A4
A3
A2
128 K x 16
RAM Array
I/O0–I/O7
I/O8–I/O15
A1
A0
COLUMN DECODER
BHE
WE
CE
OE
BLE
Cypress Semiconductor Corporation
Document Number: 001-48147 Rev. *L
•
198 Champion Court
•
San Jose, CA 95134-1709
•
408-943-2600
Revised November 29, 2017