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CY62136EV30LL PDF预览

CY62136EV30LL

更新时间: 2024-01-26 00:56:02
品牌 Logo 应用领域
赛普拉斯 - CYPRESS /
页数 文件大小 规格书
12页 563K
描述
2-Mbit (128K x 16) Static RAM

CY62136EV30LL 数据手册

 浏览型号CY62136EV30LL的Datasheet PDF文件第2页浏览型号CY62136EV30LL的Datasheet PDF文件第3页浏览型号CY62136EV30LL的Datasheet PDF文件第4页浏览型号CY62136EV30LL的Datasheet PDF文件第5页浏览型号CY62136EV30LL的Datasheet PDF文件第6页浏览型号CY62136EV30LL的Datasheet PDF文件第7页 
CY62136EV30  
MoBL®  
2-Mbit (128K x 16) Static RAM  
Features  
Functional Description[1]  
• Very high speed: 45 ns  
The CY62136EV30 is a high-performance CMOS static RAM  
organized as 128K words by 16 bits. This device features  
advanced circuit design to provide ultra-low active current.  
This is ideal for providing More Battery Life™ (MoBL®) in  
portable applications such as cellular telephones. The device  
also has an automatic power-down feature that significantly  
reduces power consumption by 80% when addresses are not  
toggling. The device can also be put into standby mode  
reducing power consumption by more than 99% when  
deselected (CE HIGH). The input/output pins (I/O0 through  
I/O15) are placed in a high-impedance state when: deselected  
(CE HIGH), outputs are disabled (OE HIGH), both Byte High  
Enable and Byte Low Enable are disabled (BHE, BLE HIGH),  
or during a write operation (CE LOW and WE LOW).  
• Wide voltage range: 2.20V–3.60V  
• Pin-compatible with CY62136CV30  
• Ultra low standby power  
— Typical standby current: 1µA  
— Maximum standby current: 7µA  
• Ultra-low active power  
— Typical active current: 2 mA @ f = 1 MHz  
• Easy memory expansion with CE, and OE features  
• Automatic power-down when deselected  
• CMOS for optimum speed/power  
Writing to the device is accomplished by taking Chip Enable  
(CE) and Write Enable (WE) inputs LOW. If Byte Low Enable  
(BLE) is LOW, then data from I/O pins (I/O0 through I/O7), is  
written into the location specified on the address pins (A0  
through A16). If Byte High Enable (BHE) is LOW, then data  
from I/O pins (I/O8 through I/O15) is written into the location  
specified on the address pins (A0 through A16).  
• Offered in a Pb-free 48-ball VFBGA and 44-pin TSOP II  
packages  
Reading from the device is accomplished by taking Chip  
Enable (CE) and Output Enable (OE) LOW while forcing the  
Write Enable (WE) HIGH. If Byte Low Enable (BLE) is LOW,  
then data from the memory location specified by the address  
pins will appear on I/O0 to I/O7. If Byte High Enable (BHE) is  
LOW, then data from memory will appear on I/O8 to I/O15. See  
the truth table at the back of this data sheet for a complete  
description of read and write modes.  
Logic Block Diagram  
DATA IN DRIVERS  
A10  
A9  
A8  
A7  
A6  
A5  
A4  
A3  
A2  
128K x 16  
RAM Array  
I/O0–I/O7  
I/O8–I/O15  
A1  
A0  
COLUMN DECODER  
BHE  
WE  
CE  
OE  
BLE  
Note:  
1. For best practice recommendations, please refer to the Cypress application note “System Design Guidelines” on http://www.cypress.com.  
Cypress Semiconductor Corporation  
Document #: 38-05569 Rev. *B  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised January 6, 2006  
[+] Feedback  

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