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CY62128EV30_1106 PDF预览

CY62128EV30_1106

更新时间: 2024-01-15 06:33:08
品牌 Logo 应用领域
赛普拉斯 - CYPRESS /
页数 文件大小 规格书
18页 952K
描述
1-Mbit (128 K x 8) Static RAM Automatic power-down when deselected

CY62128EV30_1106 数据手册

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CY62128EV30 MoBL®  
1-Mbit (128 K × 8) Static RAM  
1-Mbit (128  
K × 8) Static RAM  
Features  
Functional Description  
Very high speed: 45 ns  
The CY62128EV30 is a high performance CMOS static RAM  
module organized as 128K words by 8-bits. This device features  
advanced circuit design to provide ultra low active current. This  
is ideal for providing More Battery Life™ (MoBL®) in portable  
applications such as cellular telephones. The device also has an  
automatic power-down feature that significantly reduces power  
consumption when addresses are not toggling. Placing the  
device in standby mode reduces power consumption by more  
than 99 percent when deselected (CE1 HIGH or CE2 LOW). The  
eight input and output pins (I/O0 through I/O7) are placed in a  
high impedance state when the device is deselected (CE1 HIGH  
or CE2 LOW), the outputs are disabled (OE HIGH), or a write  
operation is in progress (CE1 LOW and CE2 HIGH and WE  
LOW).  
Temperature ranges:  
Industrial: –40 °C to +85 °C  
Wide voltage range: 2.2 V to 3.6 V  
Pin compatible with CY62128DV30  
Ultra low standby power  
Typical standby current: 1 µA  
Maximum standby current: 4 µA  
Ultra low active power  
Typical active current: 1.3 mA at f = 1 MHz  
Easy memory expansion with CE1, CE2, and OE features  
Automatic power-down when deselected  
To write to the device, take chip enable (CE1 LOW and CE2  
HIGH) and write enable (WE) inputs LOW. Data on the eight I/O  
pins is then written into the location specified on the address pin  
(A0 through A16).  
Complementary metal oxide semiconductor (CMOS) for  
optimum speed and power  
To read from the device, take chip enable (CE1 LOW and CE2  
HIGH) and output enable (OE) LOW while forcing write enable  
(WE) HIGH. Under these conditions, the contents of the memory  
location specified by the address pins appear on the I/O pins.  
Offered in Pb-free 32-pin SOIC, 32-pin thin small outline  
package (TSOP) Type I, and 32-pin shrunk thin small outline  
package (STSOP) packages  
Logic Block Diagram  
I/O  
0
INPUT BUFFER  
A
A
A
A
A
A
A
A
A
0
1
2
3
4
5
6
7
8
I/O  
1
I/O  
2
128K x 8  
ARRAY  
I/O  
3
I/O  
I/O  
I/O  
I/O  
4
5
6
7
A
A
A
9
10  
11  
CE  
CE  
1
2
POWER  
DOWN  
COLUMN DECODER  
WE  
OE  
Cypress Semiconductor Corporation  
Document #: 38-05579 Rev. *J  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised June 25, 2011  
[+] Feedback  

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