PRELIMINARY
CY241V08-41
Data Retention @ Tj = 125°C................................> 10 years
Package Power Dissipation...................................... 350 mW
ESD (Human Body Model) MIL-STD-883.................> 2000V
Absolute Maximum Conditions
Supply Voltage (VDD) ........................................–0.5 to +7.0V
DC Input Voltage...................................... –0.5V to VDD + 0.5
Storage Temperature (Non-condensing).....–55°C to +125°C
(Above which the useful life may be impaired. For user guide-
lines, not tested.)
Junction Temperature ................................ –40°C to +125°C
Pullable Crystal Specifications[1]
Parameter
Description
Comments
Min. Typ. Max. Unit
FNOM
Nominal crystal frequency
Parallel resonance, fundamental mode, AT
cut
–
27
–
MHz
CLNOM
R1
Nominal load capacitance
–
–
3
14
–
–
25
–
pF
Ω
–
Equivalent series resistance (ESR)
Fundamental mode
R3/R1
Ratio of third overtone mode ESR to
fundamental mode ESR
Ratio used because typical R1 values are
much less than the maximum spec
–
DL
Crystal drive level
No external series resistor assumed
–
400
–
–
–
–
–
–
150
–
µW
F3SEPHI
F3SEPLO
C0
Third overtone separation from 3*FNOM High side
Third overtone separation from 3*FNOM Low side
Crystal shunt capacitance
ppm
–200 ppm
–
7
pF
–
C0/C1
C1
Ratio of shunt to motional capacitance
Crystal motional capacitance
180
250
21.6
14.4 18
fF
Recommended Operating Conditions
Parameter
Description
Min.
3.135
0
Typ.
3.3
–
Max.
Unit
V
VDD
TA
Operating Voltage
3.465
70
Ambient Temperature
°C
CLOAD
tPU
Max. Load Capacitance
–
–
15
pF
ms
Power-uptimefor allVDD pinstoreachminimumspecified
voltage (power ramps must be monotonic)
0.05
–
500
DC Electrical Specifications
Parameter
IOH
Name
Description
VOH = VDD – 0.5V, VDD = 3.3V
VOL = 0.5V, VDD = 3.3V
Except XIN, XOUT pins
Min.
12
12
–
Typ.
Max.
Unit
mA
mA
pF
Output HIGH Current
Output LOW Current
Input Capacitance
VCXO Input Range
VCXO Pullability Range
Supply Current
24
24
–
–
–
7
IOL
CIN
VVCXO
f∆XO
IVDD
0
–
VDD
V
±150
–
–
–
ppm
mA
–
40
AC Electrical Specifications (VDD = 3.3V)[1]
Parameter[1]
Name
Output Duty Cycle
Rising Edge Rate
Description
Min.
45
Typ. Max. Unit
DC
ER
Duty Cycle is defined in Figure 1, 50% of VDD
50
55
–
%
Output Clock Edge Rate, Measured from 20%
0.8
1.4
V/ns
to 80% of VDD, CLOAD = 15 pF. See Figure 2.
EF
Falling Edge Rate
Output Clock Edge Rate, Measured from 80%
0.8
1.4
–
V/ns
to 20% of VDD, CLOAD = 15 pF. See Figure 2.
t9
t9
Clock Jitter 83.33 MHz
Clock Jitter XBUF/27 MHz
PLL Lock Time
Peak-to-peak period jitter
Peak-to-peak period jitter
–
–
–
–
–
–
500
375
3
ps
ps
t10
ms
Note:
1. Not 100% tested.
Document #: 38-07570 Rev. **
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