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CXXXXR230-SXX00-X PDF预览

CXXXXR230-SXX00-X

更新时间： 2024-09-26 03:13:23
品牌 Logo 应用领域
科锐 - CREE /
页数 文件大小 规格书
4页 233K
描述
XT⑩ Rectangular LEDs

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CXXXXR230-SXX00-X 数据手册

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™
XT Rectangular LEDs  
CxxxXR230-Sxx00-x  
Cree’s XT Rectangular LEDs are the next generation of solid-state LEDs that combine highly efficient InGaN materials  
with Cree’s proprietary G•SiC® substrate to deliver superior price/performance for high-intensity LEDs. These LED  
chips have a geometrically enhanced Epi-down design to maximize light extraction efficiency and require only a single  
wire bond connection. These vertically structured LED chips are approximately 150 microns in height and require a low  
forward voltage. Cree’s XT Rectangular chips are tested for conformity to optical and electrical specifications and the  
ability to withstand 1000 V ESD. Applications for XT Rectangular LEDs include next-generation mobile appliances for  
use in their LCD backlights and digital camera flash where brightness, sub-miniaturization, and low power consumption  
are required.  
FEATURES  
APPLICATIONS  
•
XT Rectangular LED Performance  
460 nm & 470 nm  
•
•
Mobile Appliance LCD Backlighting  
Digital Camera Flash  
–
XR-18™ – 18.0 mW min.  
XR-21™ – 21.0 mW min.  
•
•
•
•
•
•
Thin 150 µm Chip  
Low Forward Voltage – 3.2 Typical at 20 mA  
Single Wire Bond Structure  
Class 2 ESD Rating  
Sn Contact for Low-Temp. Die Attach Methods  
Die Attach Options:  
–
–
Flux Eutectic; Flux & Temperature (-C)  
Eutectic; Temperature & Pressure (-D)  
CxxxXR230-Sxx00-x Chip Diagram  
Top View  
Bottom View  
Die Cross Section  
G•SiC LED Chip  
230 x 380 μm  
Backside  
Metalization  
Gold Bond Pad  
105 μm Diameter  
Cathode (-)  
SiC Substrate  
t = 150 µm  
Anode (+)  
Subject to change without notice.  
www.cree.com  
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