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CPS041 PDF预览

CPS041

更新时间: 2024-09-16 03:26:35
品牌 Logo 应用领域
CENTRAL 可控硅
页数 文件大小 规格书
2页 138K
描述
Silicon Controlled Rectifier Sensitive Gate SCR Chip

CPS041 数据手册

 浏览型号CPS041的Datasheet PDF文件第2页 
PROCESS CPS041  
Silicon Controlled Rectifier  
Sensitive Gate SCR Chip  
PROCESS DETAILS  
Process  
GLASS PASSIVATED MESA  
41 x 41 MILS  
Die Size  
Die Thickness  
8.7 MILS 0.6 MILS  
18 x 8 MILS  
Cathode Bonding Pad Area  
Gate Bonding Pad Area  
Top Side Metalization  
7.1 x 7.1 MILS  
Al - 45,000Å  
Back Side Metalization  
Au - 10,000Å  
GEOMETRY  
GROSS DIE PER 4 INCH WAFER  
6,474  
PRINCIPAL DEVICE TYPES  
CS18D  
BRX49  
CS92D  
CS89M  
145 Adams Avenue  
Hauppauge, NY 11788 USA  
Tel: (631) 435-1110  
Fax: (631) 435-1824  
www.centralsemi.com  
R1 (19 -May 2005)  

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