CMT01N60
POWER FIELD EFFECT TRANSISTOR
GENERAL DESCRIPTION
FEATURES
This high voltage MOSFET uses an advanced termination
scheme to provide enhanced voltage-blocking capability
without degrading performance over time. In addition, this
advanced MOSFET is designed to withstand high energy in
avalanche and commutation modes. The new energy
efficient design also offers a drain-to-source diode with a
fast recovery time. Designed for high voltage, high speed
switching applications in power supplies, converters and
PWM motor controls, these devices are particularly well
suited for bridge circuits where diode speed and
commutating safe operating areas are critical and offer
additional and safety margin against unexpected voltage
transients.
Robust High Voltage Termination
Avalanche Energy Specified
Source-to-Drain Diode Recovery Time Comparable to a
Discrete Fast Recovery Diode
Diode is Characterized for Use in Bridge Circuits
I
DSS and VDS(on) Specified at Elevated Temperature
PIN CONFIGURATION
SYMBOL
TO-251
TO-92
Front View
Front View
D
G
S
N-Channel MOSFET
2
3
1
2
3
1
ABSOLUTE MAXIMUM RATINGS
Rating
Drain to Current - TO-251(Continuous)
TO-92 (Continuous)
Symbol
Value
1.0
Unit
ID
0.5
A
- Pulsed
IDM
VGS
2.0
Gate-to-Source Voltage - Continue
- Non-repetitive
±30
±40
V
V
VGSM
Total Power Dissipation
TO-251
PD (MAX)
30
W
TO-92
3
-55 to 150
20
Operating and Storage Temperature Range
TJ, TSTG
EAS
℃
Single Pulse Drain-to-Source Avalanche Energy - TJ = 25℃
(VDD = 100V, VGS = 10V, IAS = 2A, L = 10mH, RG = 25Ω)
Thermal Resistance - Junction to Case
mJ
θJC
θJA
TL
1.0
62.5
260
℃/W
- Junction to Ambient
Maximum Lead Temperature for Soldering Purposes, 1/8” from case for 10 seconds
℃
2010/12/01 Rev. 1.7
Champion Microelectronic Corporation
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