Features
■ Lead free as standard
■ RoHS compliant*
■ Glass passivated chip
■ Low reverse leakage current
■ Low forward voltage drop
■ High current capability
CD214B-F250~F2600 Surface Mount Fast Response Rectifiers
General Information
The markets of portable communications, computing and video equipment are challenging the semiconductor industry to develop
increasingly smaller electronic components. Bourns offers Surface Mount Fast Response Rectifiers for rectification applications, in compact
chip DO-214AA (SMB) size format, which offer PCB real estate savings and are considerably smaller than most competitive parts. The Fast
Response Rectifier Diodes offer a forward current of 2.0 A with a choice of repetitive peak reverse voltages of 50 V up to 600 V.
Bourns® Chip Diodes conform to JEDEC standards, are easy to handle on standard pick and place equipment and their flat configuration
minimizes roll away.
Electrical Characteristics (@ T = 25 °C Unless Otherwise Noted)
A
CD214B-
Parameter
Symbol
Unit
F250
F2100
F2150
F2200
F2400
F2600
Maximum Repetitive
Peak Reverse Voltage
V
V
50
100
150
105
150
200
400
600
V
V
V
RRM
Maximum RMS Voltage
35
50
70
140
200
280
400
420
600
RMS
Maximum DC
Blocking Voltage
V
100
DC
Max. Average Forward
Rectified Current1
I
2.0
5.0
A
(AV)
DC Reverse Current @
Rated DC Blocking Voltage
I
µA
R
R
(@T = 25 °C)
J
DC Reverse Current @
Rated DC Blocking Voltage
I
350
200
µA
(@T = 125 °C)
J
Typical Junction Capacitance2
C
J
pF
V
Maximum Instantaneous
Forward Voltage @ 1 A
V
F
0.92
1.25
1.30
Typical Thermal Resistance3
R
15
50
°C/W
θJL
Peak forward surge current
8.3 ms single half sine-wave
superimposed on rated load
(JEDEC Method)
I
A
FSM
Notes:
1 See Figure 1.
2 Measured @ 1.0 MHz and applied reverse voltage of 4.0 VDC.
3 Thermal resistance from junction to ambient and from junction to lead P.C.B. mounted on 0.2 ˝ x 0.2 ˝ (5.0 mm x 5.0 mm) copper pad areas.
Thermal Characteristics (@ T = 25 °C Unless Otherwise Noted)
A
Parameter
Symbol
TJ
CD214B-F250~F2600
-55 to +125
Unit
Operating Temperature Range
Storage Temperature Range
°C
°C
TSTG
-55 to +150
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.