BZT52C2V4 - BZT52C39
SURFACE MOUNT ZENER DIODE
Features
·
·
·
·
Planar Die Construction
500mW Power Dissipation on Ceramic PCB
General Purpose, Medium Current
Ideally Suited for Automated Assembly
Processes
SOD-123
Dim
A
Min
3.55
2.55
1.40
—
Max
3.85
2.85
1.70
1.35
H
D
J
B
Mechanical Data
G
C
·
·
·
·
Case: SOD-123, Plastic
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020A
Terminals: Solderable per MIL-STD-202,
Method 208
a
D
A
B
E
0.55 Typical
0.25
0.11 Typical
G
H
—
E
C
·
·
·
·
Polarity: Cathode Band
Marking: See Below
Weight: 0.01 grams (approx.)
Ordering Information: See Page 4
J
—
0.10
a
0°
8°
All Dimensions in mm
@ TA = 25°C unless otherwise specified
Maximum Ratings
Characteristic
Symbol
VF
Value
0.9
Unit
V
Forward Voltage (Note 2)
Power Dissipation (Note 1)
@ IF = 10mA
Pd
500
mW
°C/W
°C
RqJA
Thermal Resistance, Junction to Ambient Air (Note 1)
Operating and Storage Temperature Range
305
Tj, TSTG
-65 to +150
Notes:
1. Device mounted on ceramic PCB; 7.6mm x 9.4mm x 0.87mm with pad areas 25mm2.
2. Short duration test pulse used to minimize self-heating effect.
Marking Information
XX = Product Type Marking Code (See Page 2)
YM = Date Code Marking
Y = Year (ex: N = 2002)
M = Month (ex: 9 = September)
XX
Date Code Key
Year
1998
1999
2000
2001
2002
2003
2004
2005
Code
J
K
L
M
N
P
R
S
Month
Code
Jan
Feb
March
Apr
May
Jun
Jul
Aug
Sep
Oct
Nov
Dec
1
2
3
4
5
6
7
8
9
O
N
D
DS18004 Rev. 19 - 2
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BZT52C2V4 - BZT52C39