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BULD741-1 PDF预览

BULD741-1

更新时间: 2024-09-26 03:23:11
品牌 Logo 应用领域
意法半导体 - STMICROELECTRONICS 晶体开关晶体管高压
页数 文件大小 规格书
11页 313K
描述
High voltage fast-switching NPN power transistor

BULD741-1 技术参数

是否Rohs认证: 符合生命周期:Active
零件包装代码:TO-251包装说明:ROHS COMPLIANT, IPAK-3
针数:3Reach Compliance Code:compliant
风险等级:5.71最大集电极电流 (IC):2.5 A
集电极-发射极最大电压:400 V配置:SINGLE
最小直流电流增益 (hFE):25JEDEC-95代码:TO-251
JESD-30 代码:R-PSIP-T3JESD-609代码:e3
湿度敏感等级:1元件数量:1
端子数量:3最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:IN-LINE峰值回流温度(摄氏度):225
极性/信道类型:NPN最大功率耗散 (Abs):30 W
认证状态:Not Qualified子类别:Other Transistors
表面贴装:NO端子面层:MATTE TIN
端子形式:THROUGH-HOLE端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

BULD741-1 数据手册

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BULD741  
High voltage fast-switching NPN power transistor  
Features  
High voltage capability  
Low spread of dynamic parameters  
Minimum lot-to-lot spread for reliable operation  
Very high switching speed  
3
3
2
1
Description  
1
The device is manufactured using high voltage  
Multi-Epitaxial Planar technology for high  
switching speeds and high voltage capability.  
DPAK  
TO-252  
IPAK  
TO-251  
Thanks to an increased intermediate layer, it has  
an intrinsic ruggedness which enables the  
transistor to withstand an high collector current  
level during breakdown condition, without using  
the transil protection usually necessary in typical  
converters for lamp ballast.  
Figure 1.  
Internal schematic diagram  
Applications  
Electronic ballast for fluorescent lighting  
Switch mode power supplies.  
Table 1.  
Order codes  
BULD741T4  
BULD741-1  
Device summary  
Marking  
Package  
Packaging  
BULD741  
BULD741  
DPAK  
IPAK  
Tape & reel  
Tube  
July 2007  
Rev 2  
1/11  
www.st.com  
11  

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