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BS616LV4010EIG10 PDF预览

BS616LV4010EIG10

更新时间: 2024-11-06 04:12:39
品牌 Logo 应用领域
BSI 静态存储器光电二极管内存集成电路
页数 文件大小 规格书
9页 269K
描述
Standard SRAM, 256KX16, 100ns, CMOS, PDSO44, TSOP2-44

BS616LV4010EIG10 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete包装说明:TSOP2, TSOP44,.46,32
Reach Compliance Code:unknown风险等级:5.84
最长访问时间:100 ns备用内存宽度:8
I/O 类型:COMMONJESD-30 代码:R-PDSO-G44
长度:18.41 mm内存密度:4194304 bit
内存集成电路类型:STANDARD SRAM内存宽度:16
湿度敏感等级:3功能数量:1
端子数量:44字数:262144 words
字数代码:256000工作模式:ASYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:256KX16输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:TSOP2
封装等效代码:TSOP44,.46,32封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE并行/串行:PARALLEL
峰值回流温度(摄氏度):260电源:3/3.3 V
认证状态:Not Qualified座面最大高度:1.2 mm
最大待机电流:0.000001 A最小待机电流:1.5 V
子类别:SRAMs最大压摆率:0.02 mA
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):2.7 V
标称供电电压 (Vsup):3 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子形式:GULL WING端子节距:0.8 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:10.16 mmBase Number Matches:1

BS616LV4010EIG10 数据手册

 浏览型号BS616LV4010EIG10的Datasheet PDF文件第2页浏览型号BS616LV4010EIG10的Datasheet PDF文件第3页浏览型号BS616LV4010EIG10的Datasheet PDF文件第4页浏览型号BS616LV4010EIG10的Datasheet PDF文件第5页浏览型号BS616LV4010EIG10的Datasheet PDF文件第6页浏览型号BS616LV4010EIG10的Datasheet PDF文件第7页 
Very Low Power/Voltage CMOS SRAM  
256K X 16 bit  
BSI  
BS616LV4010  
„ DESCRIPTION  
„ FEATURES  
The BS616LV4010 is a high performance, very low power CMOS Static  
Random Access Memory organized as 262,144 words by 16 bits and  
operates from a wide range of 2.7V to 3.6V supply voltage.  
Advanced CMOS technology and circuit techniques provide both high  
speed and low power features with a typical CMOS standby current  
of 0.5uA and maximum access time of 70ns in 3V operation.  
Easy memory expansion is provided by an active LOW chip  
enable(CE) and active LOW output enable(OE) and three-state output  
drivers.  
The BS616LV4010 has an automatic power down feature, reducing the  
power consumption significantly when chip is deselected.  
The BS616LV4010 is available in DICE form, JEDEC standard 44-pin  
TSOP Type II package and 48-pin BGA package.  
• Very low operation voltage : 2.7 ~ 3.6V  
• Very low power consumption :  
Vcc = 3.0V  
C-grade: 20mA (Max.) operating current  
I -grade: 25mA (Max.) operating current  
0.5uA (Typ.) CMOS standby current  
• High speed access time :  
-70  
-10  
70ns (Max.) at Vcc = 3.0V  
100ns (Max.) at Vcc = 3.0V  
• Automatic power down when chip is deselected  
• Three state outputs and TTL compatible  
• Fully static operation  
• Data retention supply voltage as low as 1.5V  
• Easy expansion with CE and OE options  
• I/O Configuration x8/x16 selectable by LB and UB pin  
„ PRODUCT FAMILY  
POWER DISSIPATION  
SPEED  
( ns )  
STANDBY  
Operating  
PRODUCT  
FAMILY  
OPERATING  
TEMPERATURE  
Vcc  
RANGE  
( ICCSB1, Max )  
( ICC, Max )  
PKG TYPE  
Vcc=3.0V  
Vcc=3.0V  
8uA  
Vcc=3.0V  
20mA  
BS616LV4010DC  
BS616LV4010EC  
BS616LV4010AC  
BS616LV4010BC  
BS616LV4010DI  
BS616LV4010EI  
BS616LV4010AI  
BS616LV4010BI  
DICE  
TSOP2-44  
BGA-48-0608  
BGA-48-0810  
DICE  
TSOP2-44  
BGA-48-0608  
BGA-48-0810  
+0 O C to +70O  
-40O C to +85O  
C
C
2.7V ~ 3.6V  
2.7V ~ 3.6V  
70 / 100  
70 / 100  
12uA  
25mA  
„ PIN CONFIGURATIONS  
„ BLOCK DIAGRAM  
1
44  
43  
42  
41  
40  
39  
38  
37  
36  
35  
34  
33  
32  
31  
30  
29  
28  
27  
26  
25  
24  
23  
A4  
A5  
A6  
A7  
OE  
UB  
LB  
2
3
4
5
6
7
8
9
10  
11  
12  
13  
14  
15  
16  
17  
A3  
A2  
A1  
A0  
CE  
DQ0  
DQ1  
DQ2  
DQ3  
VCC  
GND  
DQ4  
DQ5  
DQ6  
DQ7  
WE  
DQ15  
DQ14  
DQ13  
DQ12  
GND  
VCC  
DQ11  
DQ10  
DQ9  
DQ8  
NC  
A8  
A9  
A10  
A11  
A12  
A4  
A3  
A2  
BS616LV4010EC  
BS616LV4010EI  
A1  
A0  
Address  
Input  
22  
2048  
A17  
A16  
Row  
Decoder  
Memory Array  
2048 x 2048  
Buffer  
18  
19  
20  
21  
A17  
A16  
A15  
A14  
A15  
A14  
A13  
A12  
22  
A13  
2048  
Data  
Input  
16  
16  
Column I/O  
DQ0  
Buffer  
.
.
.
.
.
.
.
.
Write Driver  
Sense Amp  
16  
128  
Data  
Output  
16  
Buffer  
Column Decoder  
DQ15  
14  
CE  
WE  
OE  
UB  
Control  
Address Input Buffer  
LB  
A11 A10 A9 A8 A7  
A6 A5  
Vcc  
Gnd  
Brilliance Semiconductor, Inc. reserves the right to modify document contents without notice.  
Revision 2.4  
R0201-BS616LV4010  
1
Jan.  
2004  

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