是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | SOT-23 |
包装说明: | SOT-23, 3 PIN | 针数: | 3 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.32.00.71 | Factory Lead Time: | 6 weeks |
风险等级: | 5.3 | Is Samacsys: | N |
其他特性: | ORGANIZED AS 4 PAGES OF 32 BYTES EACH | 最大时钟频率 (fCLK): | 0.01667 MHz |
I/O 类型: | COMMON | JESD-30 代码: | R-PDSO-G3 |
JESD-609代码: | e4 | 长度: | 2.92 mm |
内存密度: | 1024 bit | 内存集成电路类型: | OTP ROM |
内存宽度: | 1 | 湿度敏感等级: | 1 |
功能数量: | 1 | 端子数量: | 3 |
字数: | 1024 words | 字数代码: | 1000 |
工作模式: | ASYNCHRONOUS | 最高工作温度: | 70 °C |
最低工作温度: | -20 °C | 组织: | 1KX1 |
输出特性: | OPEN-DRAIN | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | TSSOP | 封装等效代码: | TO-236 |
封装形状: | RECTANGULAR | 封装形式: | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
并行/串行: | SERIAL | 峰值回流温度(摄氏度): | 260 |
电源: | 3/5 V | 认证状态: | Not Qualified |
座面最大高度: | 1.12 mm | 子类别: | OTP ROMs |
最大压摆率: | 0.00002 mA | 最大供电电压 (Vsup): | 5.5 V |
最小供电电压 (Vsup): | 2.65 V | 标称供电电压 (Vsup): | 2.7 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | OTHER | 端子面层: | Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式: | GULL WING | 端子节距: | 0.95 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 1.3 mm | Base Number Matches: | 1 |
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