P-Channel Enhancement Mode MOSFET
BL4435A-S8
Electrical Characteristics (@ TA = 25°C unless otherwise specified)
Symbol
Parameter
Test Condition
Min. Typ. Max. Unit
Static Characteristics
VDSS
IDSS
IGSS
Drain-Source Breakdown Voltage
VGS = 0V, ID = -250μA
VDS = -30V, VGS = 0V
VGS = ±20V, VDS = 0V
-30
-
-
-
-
V
Zero Gate Voltage Drain Current
Gate-Body Leakage Current
-
-
-1
μA
nA
±100
On Characteristics
RDS(ON)
Drain-Source On-resistance *2
VGS = -10V,ID = -9.1A
VGS = -4.5V,ID = -6.9A
VDS = VGS, ID = -250μA
-
-
24
34
30
40
-3
mΩ
mΩ
V
VGS(th)
Gate Threshold Voltage
-1
-1.5
Dynamic Characteristics
CISS
COSS
CRSS
Input Capacitance
-
-
-
916
112
101
-
-
-
VGS = 0V
Output Capacitance
VDS = -15V
f = 1.0MHz
pF
ns
Reverse Transfer Capacitance
Switching Characteristics
td(ON)
tr
td(OFF)
tf
Turn-on Delay Time *4
Turn-on Rise Time *4
Turn-Off Delay Time *4
Turn-Off Fall Time *4
Total Gate-Charge
-
-
-
-
-
-
-
10
15
-
-
-
-
-
-
-
VDD = -15V, VGS = -10V
RG = 6Ω, ID = -1A
110
70
QG
20
VDD = -15V
VGS = -10V
ID = -4A
QGS
QGD
Gate to Source Charge
Gate to Drain (Miller) Charge
2.6
3.3
nC
V
Source-Drain Diode Characteristics
VSD
Diode Forward Voltage *2
Notes:
ISD = -2.1A, VGS = 0V
-
-0.8
-1.2
1. The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper
2. The data tested by pulsed, pulse width ≤ 300μs, duty cycle ≤ 2%
3. The EAS data shows Max. rating. The test condition is VDD = -15V, VGS = -10V, L = 0.5mH
4. Guaranteed by design, not subject to production
MTM1132A: April 2023 [2.0]
www.gmesemi.com
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