BGW211

更新时间： 2024-11-24 03:21:51

品牌	Logo	应用领域
恩智浦 - NXP		电信集成电路电信电路信息通信管理 WLAN 无线局域网
页数	文件大小	规格书
4页	130K
描述
Low-power WLAN SiP

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技术参数
数据手册

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BGW211 技术参数

生命周期：	Obsolete	包装说明：	HVQFN-68
Reach Compliance Code：	unknown	风险等级：	5.84
JESD-30 代码：	R-XQCC-N68	功能数量：	1
端子数量：	68	封装主体材料：	UNSPECIFIED
封装代码：	HQCCN	封装形状：	RECTANGULAR
封装形式：	CHIP CARRIER, HEAT SINK/SLUG	表面贴装：	YES
技术：	BICMOS	电信集成电路类型：	TELECOM CIRCUIT
端子形式：	NO LEAD	端子位置：	QUAD
Base Number Matches：	1

BGW211 数据手册

Complete, single-package 802.11g

solution for mobile phones and

portable consumer devices

BGW211 Low-power

WLAN SiP

Optimized for use in battery-powered handheld devices,

the BGW211 System-in-a-Package (SiP) delivers complete

802.11g functionality with the industry’s lowest standby and

operating power consumption. It requires no external com-

ponents and uses only 150 mm²of board area for the total

802.11g solution.

S e m i c o n d u c t o r s

The BGW211 is Philips’ third-generation System-in-a-Package (SiP)

solution for low-power 802.11 Wireless LAN (WLAN). Supporting

complete 802.11g functionality, it enables consumers to access data and

multimedia content through WLAN networks up to ﬁve times faster

than current 802.11b products without compromising battery life.

The BGW211 delivers industry-leading standby and operating power in a

package that measures only 150 mm²and requires no external compo-

nents for operation. Extensive support for Quality of Service (QoS) and

coexistence with Bluetooth wireless make it robust enough for very

demanding portable applications.

The latest SiP technology from Philips allows all of the components

needed for a complete 802.11g WLAN subsystem to be contained in

a single, low-proﬁle HVQFN package that measures only 10 x 15 x 1.3

mm. The SiP contains the industry’s ﬁrst 90-nm CMOS 802.11g base-

band/MAC and a silicon-germanium BiCMOS radio transceiver. Unlike

other “one-chip” solutions, which require the use of external receive

LNAs, transmit power ampliﬁers, and/or additional components, the

BGW211 SiP requires no external components to meet the range and

throughput performance requirements of mobile handsets and network

operators.

Key features

• Advanced, single-package WLAN 802.11g optimized for mobile

handheld devices

– No RF-critical design required

– Low total cost of ownership

• Lowest-power consumption in standby (< 2 mW) and operating

modes (PA, RF, baseband/MAC)

• Ultra-small form factor

– Low-proﬁle 68-pin HVQFN-like SiP package (10 x 15 x 1.3 mm)

– No external components required

• Ideal mobile architecture

By providing complete system functionality in a single package, the SiP

format delivers quicker design cycles, reduces risk, simpliﬁes manufac-

turing, and reduces the bill of materials. Also, because the SiP offers

fully tested functionality, it lets the customer’s development team focus

their energy on innovative product design instead of the complex issues

related to RF layout.

– No WLAN related processor load in all operating modes

– Integrated ARM7 controller with associated memories

• Comprehensive QoS

– All mandatory 802.11e features, plus DLS, Block ACK, APSD

– Optimized for real-time applications with minimal system power

consumption

• Co-exists with Bluetooth^®

• Seamless upgrade path from BGW200 802.11b SiP

• Complete software drivers, utilities, and diagnostic tools

12 3 4

中文翻译

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