BD1Hx500 Series BD1HxU50 Series
Absolute Maximum Ratings
Parameter
Symbol
Rating
44.5 (Internal limitation)
40
Unit
Voltage between drain and source
Power supply voltage
Input voltage
VDS
VDD
VIN
VST
IOD
IOP
V
V
(1)
-0.3 to +12
V
(1)
Diagnostic output voltage
-0.3 to +15
V
(2)
Output current (DC)
0.8
A
(3)
Output current (Pulse)
Internal limitation
A
Diagnostic output current
Power Consumption
IST
1
mA
(4)
2.100 (HTSOP-J8)
(5)
Pd
1.750(HSON 8)
0.587 (MSOP 8)
-40 ≤ Topr < +150
-55 to +150
150
W
(6)
Operating temperature range
Storage temperature range
Topr
Tstg
°C
°C
°C
mJ
Maximum junction temperature
Active clamp energy (single pulse)
Tjmax
EAV
33
Operating Voltage Ratings
Parameter
Symbol
VDD
Rating
4 to 18
Unit
V
Operating voltage
(1) However, VDD ≥ VIN
(2) However, exceed neither Pd nor ASO.
(3) Because of overcurrent protection circuit. (Refer to P11 Figure 20)
(4) IC mounted on ROHM standard board (70×70×1.6[mm], copper area 70×70[mm], glass epoxy 2 layer board).
Derate by 16.8mW above 25°C
(5) IC mounted on ROHM standard board (70×70×1.6[mm], copper area 70×70[mm], glass epoxy 2 layer board).
Derate by 14.0mW above 25°C
(6) IC mounted on ROHM standard board (70×70×1.6[mm], copper area 70×70[mm], glass epoxy 1 layer board).
Derate by 4.7mW above 25°C.
Heat Dissipation Characteristic
4.00
3.750 W
(1) HTSOP-J8(glass epoxy 4 layer board)
(2) HTSOP-J8(glass epoxy 2 layer board)
(3) HSON8 (glass epoxy 2 layer board)
(4) MSOP8 (glass epoxy 1 layer board)
3.50
3.00
2.50
2.00
1.50
1.00
0.50
0.00
(1) HTSOP-J8
2.100 W
1.750 W
(2) HTSOP-J8
(3) HSON8
0.587 W
(4) MSOP8
0
25
50
75
100
125
150
Ta [°C]
(HTSOP-J8) (1)IC mounted on ROHM standard board (70×70×1.6[mm], copper area 70×70[mm],
glass epoxy 4 layer board). Derate by 30mW/°C above 25°C.
(2)IC mounted on ROHM standard board (70×70×1.6[mm], copper area 70×70[mm],
glass epoxy 2 layer board). Derate by 16.8mW/°C above 25°C.
(HSON 8)
(MSOP 8)
(3)IC mounted on ROHM standard board (70×70×1.6[mm], copper area 70×70[mm],
glass epoxy 2 layer board). Derate by 14.0mW/°C above 25°C.
(4)IC mounted on ROHM standard board (70×70×1.6[mm],copper area 70×70[mm],
glass epoxy 1 layer board). Derate by 4.7mW/°C above 25°C.
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TSZ02201-0G3G0BD00070-1-2
2022.05.10 Rev.004
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