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BCM384F120T300A00 PDF预览

BCM384F120T300A00

更新时间: 2024-11-11 19:52:59
品牌 Logo 应用领域
VICOR /
页数 文件大小 规格书
21页 1326K
描述
DC-DC Unregulated Power Supply Module

BCM384F120T300A00 技术参数

生命周期:Active包装说明:,
Reach Compliance Code:compliantECCN代码:EAR99
风险等级:2.11Is Samacsys:N
模拟集成电路 - 其他类型:DC-DC UNREGULATED POWER SUPPLY MODULE最大输入电压:400 V
最小输入电压:360 V标称输入电压:384 V
JESD-30 代码:R-XQMA-J60长度:32.5 mm
功能数量:1输出次数:1
端子数量:60最高工作温度:125 °C
最低工作温度:-40 °C最大输出电压:12.5 V
最小输出电压:11.3 V标称输出电压:12 V
封装主体材料:UNSPECIFIED封装形状:RECTANGULAR
封装形式:MICROELECTRONIC ASSEMBLY座面最大高度:6.98 mm
表面贴装:YES技术:HYBRID
温度等级:AUTOMOTIVE端子形式:J BEND
端子位置:QUAD最大总功率输出:300 W
微调/可调输出:NO宽度:22 mm
Base Number Matches:1

BCM384F120T300A00 数据手册

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BCM® Bus Converter  
BCM384x120y300Azz  
S
®
C
NRTL US  
C
US  
Isolated Fixed Ratio DC-DC Converter  
Features & Benefits  
Product Ratings  
384VDC – 12.0VDC 300W Bus Converter  
VIN = 384V (360 – 400V)  
POUT= up to 300W  
K = 1/32  
High efficiency (>94%) reduces system  
power consumption  
VOUT = 12.0V (11.3 – 12.5V)  
(no load)  
High power density (>1022W/in3)  
reduces power system footprint by >40%  
Description  
Contains built-in protection features:  
n Undervoltage  
The VI Chip® bus converter is a high efficiency (>94%) Sine  
Amplitude Converter™ (SAC™) operating from a 360 to 400VDC  
primary bus to deliver an isolated, ratiometric output voltage from  
11.3 to 12.5VDC. The Sine Amplitude Converter offers a low AC  
impedance beyond the bandwidth of most downstream regulators;  
therefore capacitance normally at the load can be located at the  
input to the Sine Amplitude Converter. Since the transformation  
ratio of the BCM384x120y300Azz is 1/32, the capacitance value  
can be reduced by a factor of 1024x, resulting in savings of board  
area, materials and total system cost.  
n Overvoltage Lockout  
n Overcurrent Protection  
n Short circuit Protection  
n Overtemperature Protection  
Provides enable/disable control,  
internal temperature monitoring  
Can be paralleled to create multi-kW arrays  
The BCM384F120y300Azz is provided in a VI Chip package  
compatible with standard pick-and-place and surface mount  
assembly processes. The co-molded VI Chip package provides  
enhanced thermal management due to a large thermal interface  
area and superior thermal conductivity. The high conversion  
efficiency of the BCM384x120y300Azz increases overall  
system efficiency and lowers operating costs compared to  
conventional approaches.  
Typical Applications  
High End Computing Systems  
Automated Test Equipment  
High Density Power Supplies  
Communications Systems  
Typical Application  
PC  
TM  
enable / disable  
switch  
L
O
A
D
BCM®  
SW1  
F1  
+IN  
+OUT  
VOUT  
C1  
1µF  
VIN  
-IN  
-OUT  
BCM® Bus Converter  
Page 1 of 21  
Rev 1.5  
08/2016  
vicorpower.com  
800 927.9474  

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