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BCM384T480T325A00 PDF预览

BCM384T480T325A00

更新时间： 2024-10-13 08:50:03
品牌 Logo 应用领域
VICOR 转换器模拟IC信号电路
页数 文件大小 规格书
18页 1442K
描述
Bus Converter

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中文翻译

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BCM384T480T325A00 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Obsolete零件包装代码：DIP
包装说明：QMA,针数：30
Reach Compliance Code：compliantHTS代码：8542.39.00.01
风险等级：8.64模拟集成电路 - 其他类型：ANALOG CIRCUIT
JESD-30 代码：R-XQMA-T60JESD-609代码：e4
长度：32.5 mm湿度敏感等级：6
信道数量：1功能数量：1
端子数量：60最高工作温度：125 °C
最低工作温度：-40 °C封装主体材料：UNSPECIFIED
封装代码：QMA封装形状：RECTANGULAR
封装形式：MICROELECTRONIC ASSEMBLY峰值回流温度（摄氏度）：245
认证状态：Not Qualified座面最大高度：6.98 mm
最大供电电压 (Vsup)：400 V最小供电电压 (Vsup)：360 V
标称供电电压 (Vsup)：384 V表面贴装：NO
技术：HYBRID温度等级：AUTOMOTIVE
端子面层：Nickel/Palladium/Gold (Ni/Pd/Au)端子形式：THROUGH-HOLE
端子位置：QUAD处于峰值回流温度下的最长时间：NOT SPECIFIED
宽度：22 mmBase Number Matches：1

BCM384T480T325A00 数据手册

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BCM384 x 480T325A00  
BCM™  
Bus Converter  
S
C
NRTL US  
FEATURES  
DESCRIPTION  
The V•I Chip™ bus converter is a high efficiency (>95%) Sine  
Amplitude Converter™ (SAC™) operating from a 360 to 400  
Vdc primary bus to deliver an isolated 45 – 50 V nominal,  
unregulated secondary. The SAC offers a low AC impedance  
beyond the bandwidth of most downstream regulators,  
meaning that input capacitance normally located at the input  
of a regulator can be located at the input to the SAC. Since the  
K factor of the BCM384F480T325A00 is 1/8, that capacitance  
value can be reduced by a factor of 64x, resulting in savings of  
board area, materials and total system cost.  
• 384 Vdc – 48 Vdc 325 W Bus Converter  
• High efficiency (>95%) reduces system power  
consumption  
• High power density (>1000 W/in3)  
reduces power system footprint by >40%  
•
• “Full Chip” V I Chip package enables surface mount,  
low impedance interconnect to system board  
• Contains built-in protection features: undervoltage,  
overvoltage lockout, overcurrent protection, short  
circuit protection, overtemperature protection.  
The BCM384F480T325A00 is provided in a V•I Chip package  
compatible with standard pick-and-place and surface mount  
assembly processes. The V•I Chip package provides flexible  
thermal management through its low junction-to-case and  
junction-to-board thermal resistance. With high conversion  
efficiency the BCM384F480T325A00 increases overall system  
efficiency and lowers operating costs compared to  
conventional approaches.  
• Provides enable/disable control, internal temperature  
monitoring  
• ZVS/ZCS Resonant Sine Amplitude Converter topology  
• Can be paralleled to create multi-kW arrays  
TYPICAL APPLICATIONS  
VIN = 360 – 400 V  
OUT = 45 – 50 V(NO LOAD)  
POUT = 325 W(NOM)  
K = 1/8  
• High End Computing Systems  
• Automated Test Equipment  
• Telecom Base Stations  
V
PART NUMBERING  
• High Density Power Supplies  
• Communications Systems  
PART NUMBER  
PACKAGE STYLE  
PRODUCT GRADE  
F = J-Lead  
BCM384 x  
480  
T325A00  
T = -40° to 125°C  
T = Through hole  
For Storage and Operating Temperatures see Section 6.0 General Characteristics  
TYPICAL APPLICATION  
VC  
VC  
SG  
OS  
CD  
PR  
PC  
TM  
PC  
enable / disable  
TM  
PC  
TM  
IL  
L
O
A
D
switch  
SW1  
PRM  
VTM  
BCM  
F1  
+Out  
+In  
+Out  
+In  
-In  
+Out  
+In  
C1  
1 µF  
VIN  
-Out  
-In  
-Out  
-Out  
-In  
Rev. 1.9  
4/2011  
V•I CHIP CORP. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200  
Page 1 of 18  
vicorpower.com  
1234567...18

中文翻译

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