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BCM384T480T325B00 PDF预览

BCM384T480T325B00

更新时间: 2024-11-19 21:08:47
品牌 Logo 应用领域
VICOR 输出元件
页数 文件大小 规格书
22页 1695K
描述
DC-DC Regulated Power Supply Module

BCM384T480T325B00 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active包装说明:QMA,
Reach Compliance Code:compliantECCN代码:EAR99
风险等级:2.29模拟集成电路 - 其他类型:DC-DC REGULATED POWER SUPPLY MODULE
认证:CURUS, CTUVUS,CE控制模式:VOLTAGE-MODE
效率(主输出):96%高度:6.98 mm
最大输入电压:400 V最小输入电压:360 V
标称输入电压:384 VJESD-30 代码:R-XQMA-T60
长度:32.5 mm功能数量:1
输出次数:1端子数量:60
最高工作温度:125 °C最低工作温度:-40 °C
最大输出电流:10.5 A最大输出电压:50 V
最小输出电压:45 V标称输出电压:48 V
封装主体材料:UNSPECIFIED封装代码:QMA
封装形状:UNSPECIFIED封装形式:MICROELECTRONIC ASSEMBLY
保护:OUTPUT OVER CURRENT; OUTPUT OVER VOLTAGE; THERMAL纹波电压(主输出):0.1414 Vrms
座面最大高度:6.98 mm表面贴装:NO
最大切换频率:1730 kHz技术:HYBRID
温度等级:AUTOMOTIVE端子形式:THROUGH-HOLE
端子位置:QUAD最大总功率输出:325 W
微调/可调输出:NO宽度:22 mm
Base Number Matches:1

BCM384T480T325B00 数据手册

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BCM® Bus Converter  
BCM384x480y325Bzz  
S
®
C
NRTL US  
C
US  
Isolated Fixed Ratio DC-DC Converter  
Features & Benefits  
Product Ratings  
384VDC – 48VDC 325W Bus Converter  
VIN = 384V (360 – 400V)  
POUT = up to 325W  
K = 1/8  
High efficiency (95%) reduces system  
power consumption  
V
OUT = 48V (45 – 50V)  
(no load)  
High power density (1106W/in3)  
reduces power system footprint by >40%  
Description  
Contains built-in protection features:  
n Undervoltage  
The VI Chip® bus converter is a high efficiency (95%) Sine  
Amplitude Converter™ (SAC™) operating from a 360 to 400VDC  
primary bus to deliver an isolated, ratiometric output voltage from  
45 to 50VDC. The Sine Amplitude Converter offers a low AC  
impedance beyond the bandwidth of most downstream regulators;  
therefore capacitance normally at the load can be located at the  
input to the Sine Amplitude Converter. Since the transformation  
ratio of the BCM384x480y325Bzz is 1/8, the capacitance value can  
be reduced by a factor of 64x, resulting in savings of board area,  
materials and total system cost.  
n Overvoltage Lockout  
n Overcurrent Protection  
n Short circuit Protection  
n Overtemperature Protection  
Provides enable/disable control,  
internal temperature monitoring  
Can be paralleled to create multi-kW arrays  
The BCM384F480y325Bzz is provided in a VI Chip package  
compatible with standard pick-and-place and surface mount  
assembly processes. The co-molded VI Chip package provides  
enhanced thermal management due to a large thermal interface  
area and superior thermal conductivity. The high conversion  
efficiency of the BCM384x480y325Bzz increases overall  
system efficiency and lowers operating costs compared to  
conventional approaches.  
Typical Applications  
High End Computing Systems  
Automated Test Equipment  
High Density Power Supplies  
Communications Systems  
Typical Application  
BCM  
TM  
PC  
enable/disable  
switch  
F1  
+IN  
+OUT  
COUT  
POL  
VIN  
CIN  
–OUT  
–IN  
GND  
PRIMARY  
SECONDARY  
ISOLATION BOUNDRY  
BCM® Bus Converter  
Page 1 of 22  
Rev 1.1  
10/2016  
vicorpower.com  
800 927.9474  

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