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BC557BG

更新时间: 2024-11-04 04:08:55
品牌 Logo 应用领域
安森美 - ONSEMI 晶体放大器晶体管
页数 文件大小 规格书
7页 78K
描述
Amplifier Transistors PNP Silicon

BC557BG 技术参数

是否无铅: 不含铅生命周期:End Of Life
零件包装代码:TO-92包装说明:CYLINDRICAL, O-PBCY-T3
针数:3Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8541.21.00.75
Factory Lead Time:1 week风险等级:5.19
最大集电极电流 (IC):0.1 A集电极-发射极最大电压:45 V
配置:SINGLE最小直流电流增益 (hFE):180
JEDEC-95代码:TO-92JESD-30 代码:O-PBCY-T3
JESD-609代码:e1元件数量:1
端子数量:3最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:ROUND
封装形式:CYLINDRICAL峰值回流温度(摄氏度):260
极性/信道类型:PNP最大功率耗散 (Abs):1.5 W
认证状态:Not Qualified子类别:Other Transistors
表面贴装:NO端子面层:Tin/Silver/Copper (Sn/Ag/Cu)
端子形式:THROUGH-HOLE端子位置:BOTTOM
处于峰值回流温度下的最长时间:40晶体管应用:AMPLIFIER
晶体管元件材料:SILICON标称过渡频率 (fT):320 MHz
Base Number Matches:1

BC557BG 数据手册

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BC556B, BC557A, B, C,  
BC558B, C  
Amplifier Transistors  
PNP Silicon  
http://onsemi.com  
Features  
Pb−Free Packages are Available*  
COLLECTOR  
1
MAXIMUM RATINGS  
2
BASE  
Rating  
Symbol  
Value  
Unit  
Collector - Emitter Voltage  
V
CEO  
V
CBO  
V
EBO  
Vdc  
3
BC556  
BC557  
BC558  
−65  
−45  
−30  
EMITTER  
Collector - Base Voltage  
Emitter - Base Voltage  
Vdc  
BC556  
BC557  
BC558  
−80  
−50  
−30  
−5.0  
Vdc  
TO−92  
CASE 29  
STYLE 17  
Collector Current − Continuous  
Collector Current − Peak  
I
−100  
−200  
mAdc  
C
I
I
1
CM  
2
3
Base Current − Peak  
−200  
mAdc  
BM  
Total Device Dissipation @ T = 25°C  
Derate above 25°C  
P
625  
5.0  
mW  
mW/°C  
A
D
D
Total Device Dissipation @ T = 25°C  
P
1.5  
12  
W
mW/°C  
C
MARKING DIAGRAM  
Derate above 25°C  
Operating and Storage Junction  
Temperature Range  
T , T  
−55 to +150  
°C  
J
stg  
THERMAL CHARACTERISTICS  
Characteristic  
BC  
55xx  
AYWW G  
G
Symbol  
Max  
Unit  
Thermal Resistance,  
Junction−to−Ambient  
R
200  
°C/W  
q
JA  
Thermal Resistance,  
Junction−to−Case  
R
83.3  
°C/W  
q
JC  
Maximum ratings are those values beyond which device damage can occur.  
Maximum ratings applied to the device are individual stress limit values (not  
normal operating conditions) and are not valid simultaneously. If these limits are  
exceeded, device functional operation is not implied, damage may occur and  
reliability may be affected.  
BC55x = Device Code  
x = 6, 7, or 8  
A
= Assembly Location  
Y
= Year  
WW  
G
= Work Week  
= Pb−Free Package  
(Note: Microdot may be in either location)  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 6 of this data sheet.  
*For additional information on our Pb−Free strategy and soldering details, please  
download the ON Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
© Semiconductor Components Industries, LLC, 2005  
1
Publication Order Number:  
September, 2005 − Rev. 2  
BC556B/D  

BC557BG 替代型号

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