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BC327RLRM PDF预览

BC327RLRM

更新时间: 2024-11-09 19:12:23
品牌 Logo 应用领域
安森美 - ONSEMI 放大器晶体管
页数 文件大小 规格书
5页 101K
描述
TRANSISTOR 800 mA, 45 V, PNP, Si, SMALL SIGNAL TRANSISTOR, TO-92, CASE 29-11, TO-226AA, 3 PIN, BIP General Purpose Small Signal

BC327RLRM 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:TO-92包装说明:CYLINDRICAL, O-PBCY-T3
针数:3Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8541.21.00.75
风险等级:5.34最大集电极电流 (IC):0.8 A
集电极-发射极最大电压:45 V配置:SINGLE
最小直流电流增益 (hFE):100JEDEC-95代码:TO-92
JESD-30 代码:O-PBCY-T3JESD-609代码:e0
元件数量:1端子数量:3
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:ROUND封装形式:CYLINDRICAL
峰值回流温度(摄氏度):225极性/信道类型:PNP
认证状态:Not Qualified表面贴装:NO
端子面层:TIN LEAD端子形式:THROUGH-HOLE
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:AMPLIFIER晶体管元件材料:SILICON
标称过渡频率 (fT):260 MHzBase Number Matches:1

BC327RLRM 数据手册

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BC327, BC327-16,  
BC327-25, BC327-40  
Amplifier Transistors  
PNP Silicon  
http://onsemi.com  
Features  
These are PbFree Devices*  
COLLECTOR  
1
MAXIMUM RATINGS  
2
BASE  
Rating  
CollectorEmitter Voltage  
CollectorEmitter Voltage  
EmitterBase Voltage  
Symbol  
Value  
45  
Unit  
Vdc  
V
CEO  
3
V
50  
Vdc  
CES  
EBO  
EMITTER  
V
5.0  
800  
Vdc  
Collector Current Continuous  
I
C
mAdc  
Total Power Dissipation @ T = 25°C  
P
D
625  
5.0  
mW  
mW/°C  
A
Derate above T = 25°C  
A
TO92  
CASE 29  
STYLE 17  
Total Power Dissipation @ T = 25°C  
P
1.5  
12  
W
A
D
Derate above T = 25°C  
mW/°C  
A
Operating and Storage Junction  
Temperature Range  
T , T  
J
55 to +150  
°C  
stg  
1
1
2
2
THERMAL CHARACTERISTICS  
Characteristic  
3
3
STRAIGHT LEAD  
BULK PACK  
BENT LEAD  
TAPE & REEL  
AMMO PACK  
Symbol  
Max  
200  
Unit  
°C/W  
°C/W  
Thermal Resistance, JunctiontoAmbient  
Thermal Resistance, JunctiontoCase  
R
q
JA  
R
83.3  
q
JC  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
MARKING DIAGRAM  
BC  
xxx  
AYWW G  
G
BCxxx= Device Code  
A
Y
= Assembly Location  
= Year  
WW = Work Week  
G
= PbFree Package  
(Note: Microdot may be in either location)  
ORDERING INFORMATION  
See detailed ordering, marking, and shipping information in  
the package dimensions section on page 4 of this data sheet.  
*For additional information on our PbFree strategy and soldering details, please  
download the ON Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
© Semiconductor Components Industries, LLC, 2011  
1
Publication Order Number:  
September, 2011 Rev. 6  
BC327/D  

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