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BAV70TT1/D PDF预览

BAV70TT1/D

更新时间： 2024-02-09 11:04:51
品牌 Logo 应用领域
其他 - ETC 二极管开关
页数 文件大小 规格书
8页 126K
描述
Dual Switching Diode

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BAV70TT1/D 技术参数

是否无铅：不含铅生命周期：Active
零件包装代码：SC-75包装说明：HALOGEN FREE AND ROHS COMPLIANT, CASE 463-01, SC-75, 3 PIN
针数：3Reach Compliance Code：compliant
ECCN代码：EAR99HTS代码：8541.10.00.70
Factory Lead Time：1 week风险等级：0.46
Is Samacsys：N配置：COMMON CATHODE, 2 ELEMENTS
二极管元件材料：SILICON二极管类型：RECTIFIER DIODE
最大正向电压 (VF)：0.715 VJESD-30 代码：R-PDSO-G3
JESD-609代码：e3湿度敏感等级：1
最大非重复峰值正向电流：0.5 A元件数量：2
端子数量：3最高工作温度：150 °C
最低工作温度：-55 °C最大输出电流：0.1 A
封装主体材料：PLASTIC/EPOXY封装形状：RECTANGULAR
封装形式：SMALL OUTLINE峰值回流温度（摄氏度）：260
最大功率耗散：0.225 W认证状态：Not Qualified
最大重复峰值反向电压：70 V最大反向恢复时间：0.006 µs
子类别：Rectifier Diodes表面贴装：YES
端子面层：Tin (Sn)端子形式：GULL WING
端子位置：DUAL处于峰值回流温度下的最长时间：40
Base Number Matches：1

BAV70TT1/D 数据手册

 浏览型号BAV70TT1/D的Datasheet PDF文件第2页浏览型号BAV70TT1/D的Datasheet PDF文件第3页浏览型号BAV70TT1/D的Datasheet PDF文件第4页浏览型号BAV70TT1/D的Datasheet PDF文件第5页浏览型号BAV70TT1/D的Datasheet PDF文件第7页浏览型号BAV70TT1/D的Datasheet PDF文件第8页 
BAV70TT1  
SOLDER STENCIL GUIDELINES  
Prior to placing surface mount components onto a printed  
The stencil opening size for the surface mounted package  
should be the same as the pad size on the printed circuit  
board, i.e., a 1:1 registration.  
circuit board, solder paste must be applied to the pads. A  
solder stencil is required to screen the optimum amount of  
solder paste onto the footprint. The stencil is made of brass  
or stainless steel with a typical thickness of 0.008 inches.  
TYPICAL SOLDER HEATING PROFILE  
For any given circuit board, there will be a group of  
control settings that will give the desired heat pattern. The  
operator must set temperatures for several heating zones,  
and a figure for belt speed. Taken together, these control  
settings make up a heating “profile” for that particular  
circuit board. On machines controlled by a computer, the  
computer remembers these profiles from one operating  
session to the next. Figure NO TAG shows a typical heating  
profile for use when soldering a surface mount device to a  
printed circuit board. This profile will vary among  
soldering systems but it is a good starting point. Factors that  
can affect the profile include the type of soldering system in  
use, density and types of components on the board, type of  
solder used, and the type of board or substrate material  
being used. This profile shows temperature versus time.  
The line on the graph shows the actual temperature that  
might be experienced on the surface of a test board at or  
near a central solder joint. The two profiles are based on a  
high density and a low density board. The Vitronics  
SMD310 convection/infrared reflow soldering system was  
used to generate this profile. The type of solder used was  
62/36/2 Tin Lead Silver with a melting point between  
177–189°C. When this type of furnace is used for solder  
reflow work, the circuit boards and solder joints tend to  
heat first. The components on the board are then heated by  
conduction. The circuit board, because it has a large surface  
area, absorbs the thermal energy more efficiently, then  
distributes this energy to the components. Because of this  
effect, the main body of a component may be up to 30  
degrees cooler than the adjacent solder joints.  
STEP 5  
HEATING  
ZONES 4 & 7  
“SPIKE”  
STEP 6 STEP 7  
VENT COOLING  
STEP 1  
PREHEAT  
ZONE 1  
STEP 2  
VENT  
“SOAK” ZONES 2 & 5  
“RAMP”  
STEP 3  
HEATING  
STEP 4  
HEATING  
ZONES 3 & 6  
“SOAK”  
205° TO 219°C  
PEAK AT  
SOLDER JOINT  
“RAMP”  
200°C  
150°C  
170°C  
DESIRED CURVE FOR HIGH  
MASS ASSEMBLIES  
160°C  
150°C  
SOLDER IS LIQUID FOR  
40 TO 80 SECONDS  
(DEPENDING ON  
140°C  
100°C  
MASS OF ASSEMBLY)  
100°C  
50°C  
DESIRED CURVE FOR LOW  
MASS ASSEMBLIES  
TIME (3 TO 7 MINUTES TOTAL)  
T
MAX  
Figure 7. Typical Solder Heating Profile  
http://onsemi.com  
6
1...345678

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