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AUIRFS3307Z

更新时间: 2024-02-06 11:23:23
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管功率场效应晶体管开关脉冲局域网
页数 文件大小 规格书
13页 267K
描述
Advanced Process Technology

AUIRFS3307Z 技术参数

是否无铅:不含铅是否Rohs认证:符合
生命周期:Transferred零件包装代码:D2PAK
包装说明:SMALL OUTLINE, R-PSSO-G2针数:3
Reach Compliance Code:compliantECCN代码:EAR99
风险等级:5.69Is Samacsys:N
其他特性:AVALANCHE RATED, ULTRA-LOW RESISTANCE, HIGH RELIABILITY雪崩能效等级(Eas):140 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:75 V最大漏极电流 (Abs) (ID):120 A
最大漏极电流 (ID):120 A最大漏源导通电阻:0.0058 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:TO-263AB
JESD-30 代码:R-PSSO-G2JESD-609代码:e3
湿度敏感等级:1元件数量:1
端子数量:2工作模式:ENHANCEMENT MODE
最高工作温度:175 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):260极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):230 W最大脉冲漏极电流 (IDM):480 A
子类别:FET General Purpose Power表面贴装:YES
端子面层:MATTE TIN OVER NICKEL端子形式:GULL WING
端子位置:SINGLE处于峰值回流温度下的最长时间:30
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

AUIRFS3307Z 数据手册

 浏览型号AUIRFS3307Z的Datasheet PDF文件第2页浏览型号AUIRFS3307Z的Datasheet PDF文件第3页浏览型号AUIRFS3307Z的Datasheet PDF文件第4页浏览型号AUIRFS3307Z的Datasheet PDF文件第5页浏览型号AUIRFS3307Z的Datasheet PDF文件第6页浏览型号AUIRFS3307Z的Datasheet PDF文件第7页 
PD - 96404A  
AUTOMOTIVE GRADE  
AUIRFS3307Z  
AUIRFSL3307Z  
HEXFET® Power MOSFET  
75V  
Features  
l
l
l
l
l
l
l
Advanced Process Technology  
D
VDSS  
UltraLowOn-Resistance  
175°COperatingTemperature  
Fast Switching  
Repetitive Avalanche Allowed up to Tjmax  
Lead-Free,RoHSCompliant  
Automotive Qualified *  
RDS(on) typ.  
max.  
ID (Silicon Limited)  
4.6mΩ  
5.8mΩ  
128A  
G
S
ID (Package Limited)  
120A  
Description  
Specifically designed for Automotive applications, this  
HEXFET® Power MOSFET utilizes the latest processing  
techniques to achieve extremely low on-resistance per  
siliconarea. Additionalfeaturesofthisdesign area175°C  
junctionoperatingtemperature, fastswitchingspeedand  
improved repetitive avalanche rating . These features  
combine to make this design an extremely efficient and  
reliable device for use in Automotive applications and a  
wide variety of other applications.  
D
D
S
S
D
G
G
D2Pak  
TO-262  
AUIRFS3307Z  
AUIRFSL3307Z  
G
D
S
Gate  
Drain  
Source  
Absolute Maximum Ratings  
Stressesbeyondthoselistedunder“AbsoluteMaximumRatings”maycausepermanentdamagetothedevice.Thesearestress  
ratings only; and functional operation of the device at these or any other condition beyond those indicated in the specifications  
is not implied.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmayaffectdevicereliability. Thethermal  
resistanceandpowerdissipationratingsaremeasuredunderboardmountedandstillairconditions.Ambienttemperature(TA)  
is 25°C, unless otherwise specified.  
Parameter  
Max.  
128  
90  
Units  
A
ID @ TC = 25°C  
ID @ TC = 100°C  
ID @ TC = 25°C  
IDM  
Continuous Drain Current, VGS @ 10V (Silicon Limited)  
Continuous Drain Current, VGS @ 10V (Silicon Limited)  
Continuous Drain Current, VGS @ 10V (Package Limited)  
Pulsed Drain Current  
120  
512  
230  
1.5  
PD @TC = 25°C  
Maximum Power Dissipation  
W
Linear Derating Factor  
W/°C  
V
± 20  
6.7  
VGS  
Gate-to-Source Voltage  
Peak Diode Recovery  
dv/dt  
EAS (Thermally limited)  
V/ns  
mJ  
A
Single Pulse Avalanche Energy  
Avalanche Current  
140  
IAR  
See Fig. 14, 15, 22a, 22b  
Repetitive Avalanche Energy  
EAR  
TJ  
mJ  
-55 to + 175  
300  
Operating Junction and  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 seconds  
(1.6mm from case)  
°C  
Thermal Resistance  
Parameter  
Typ.  
–––  
–––  
Max.  
0.65  
40  
Units  
Rθ  
Rθ  
Junction-to-Case  
Junction-to-Ambient (PCB Mount) , D2Pak  
JC  
°C/W  
JA  
HEXFET® is a registered trademark of International Rectifier.  
*Qualification standards can be found at http://www.irf.com/  
www.irf.com  
1
11/17/11  

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