Datasheet > ATS-53170D-C2-R0

ATS-53170D-C2-R0

更新时间： 2024-09-18 06:38:39

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描述
High Performance BGA Cooling

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ATS-53170D-C2-R0 数据手册

High Performance BGA Cooling

Solutions w/ maxiGRIP™ Attachment

ATS PART # ATS-53170D-C2-R0

Features & Beneﬁts

High aspect ratio, straight fin heat sinks that are ideal for

compact PCB environments

maxiGRIP™ attachment applies steady, even pressure to

the component and does not require holes in the PCB

Designed specifically for BGAs and other surface mount

packages

Meets Telcordia GR-63-Core Office Vibration; ETSI 300

019 Transportation Vibration; and MIL-STD-810 Shock

Testing and Unpackaged Drop Testing standards

Comes preassembled with high performance, phase

changing, thermal interface material

ꢁhermal Performance

*Image above is for illustration purposes only.

AIR VELOCITy

THERMAL RESISTANCE

FT/MIN

200

M/S

1.0

1.5

2.0

2.5

3.0

3.5

4.0

°C/W (UNDUCTED FLOW)

°C/W (DUCTED FLOW)

12.3

24.3

19.1

16.4

14.6

13.4

12.4

11.6

300

400

500

600

700

800

Product Details

INTERFACE MATERIAL

SAINT-GOBAIN C1100F

BLACK-ANODIZED

DIMENSION A

17 mm

DIMENSION B

DIMENSION C

DIMENSION D

FINISH

17 mm

9.5 mm

17 mm

Nꢀꢁꢂꢃ:

Dimension C = heat sink height from bottom of the base to the top of the ﬁn ﬁeld.

ATS-53170D-C1-R0 is a subsitute item available utilizing an equivalent phase change

material (Chomerics T766).

Thermal performance data are provided for reference only. Actual performance may vary

by application.

ATS reserves the right to update or change its products without notice to improve the

design or performance.

Optional maxiGRIP™ Installation/Removal Tool Set P/N: MGT170

Contact ATS to learn about custom options available.

For more information, to ﬁnd a distributor or to place an order, visit www.qats.com or

call: 781.769.2800 (North America); +31 (0) 3569 84715 (Europe).

REV1_0908

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