Datasheet > ATS-53230R-C1-R0

ATS-53230R-C1-R0

更新时间： 2024-11-09 01:14:27

品牌	Logo	应用领域
ATS		/
页数	文件大小	规格书
1页	266K
描述
BGA Heat Sink - High Performance

阅读下载

中文翻译

获取价格

数据手册

如果您发现信息不准确，欢迎纠错

ATS-53230R-C1-R0 数据手册

BGA Heat Sink - High Performance

Straight Fin w/maxiGRIP

ATS Part#:

ATS-53230D-C1-R0

Description:

23.00 x 23.00 x 9.50 mm BGA Heat Sink - High Performance Straight Fin

w/maxiGRIP

Heat Sink Type:

Straight Fin

maxiGRIP

Heat Sink Attachment:

Equivalent Part Number: ATS-53230D-C2-R0 Discontinued

*Image above is for illustration purpose only.

Features & Benefits

High aspect ratio, straight fin heat sinks that are ideal for compact PCB environments

maxiGRIP™ attachment applies steady, even pressure to the component and does not require holes in the PCB

Designed specifically for BGAs and other surface mount packages

Meets Telcordia GR-63-Core Office Vibration; ETSI 300 019 Transportation Vibration; and MIL-STD-810 Shock Testing and

Unpackaged Drop Testing standards

Comes preassembled with high performance, phase changing, thermal interface material

Thermal Performance

@200 LFM

1.0 M/S

@300 LFM

1.5 M/S

@400 LFM

2.0 M/S

@500 LFM

2.5 M/S

@600 LFM

3.0 M/S

@700 LFM

3.5 M/S

@800 LFM

4.0 M/S

AIR VELOCITY

Unducted Flow

Ducted Flow

16.8 °C/W

7.6

12.4 °C/W

N/A

10.5 °C/W

N/A

9.3 °C/W

N/A

8.5 °C/W

N/A

7.8 °C/W

N/A

7.3 °C/W

N/A

THERMAL RESISTANCE

Product Detail

Schematic Image

Dimension A

Dimension B

Dimension C

9.50 mm

Dimension D

N/A mm

TIM

Finish

BLACK-ANODIZED

23.00 mm

T766

Notes:

Dimension A and B refer to component size.

Dimension C is the heat sink height from the bottom of the base to the top of the fin field.

ATS-53230D-C2-R0 is the exact heat sink assembly with an equivalent thermal interface material

(Saint Gobain C1100F). NOTE: Saint Gobain C1100F is discontinued effective 12/31/10.

Thermal performance data are provided for reference only. Actual performance may vary by

application.

ATS reserves the right to update or change its products without notice to improve the design or

performance.

ATS certifies that this heat sink assembly is RoHS-6 and REACH compliant.

Optional maxiGRIP™ Installation/Removal Tool Set P/N: MGT170

Contact ATS to learn about custom options available.

*Image above is for illustration purpose only.

For more information, to find a distributor or to place an order, please contact us at

781-769-2800 (North America), sales@qats.com or www.qats.com.

Rev - 040517

中文翻译

下载PDF

与ATS-53230R-C1-R0相关器件

型号	品牌	获取价格	描述	数据表
ATS-53230R-C2-R0	ATS	获取价格	High Performance BGA Cooling
ATS-53250B-C1-R0	ATS	获取价格	High Performance BGA Cooling Solutions with m
ATS-53250D-C1-R0	ATS	获取价格	BGA Heat Sink - High Performance
ATS-53250D-C2-R0	ATS	获取价格	High Performance BGA Cooling
ATS-53250G-C1-R0	ATS	获取价格	High Performance BGA Cooling Solutions with m
ATS-53250K-C2-R0	ATS	获取价格	High Performance BGA Cooling
ATS-53250P-C1-R0	ATS	获取价格	High Performance BGA Cooling Solutions with m
ATS-53250R-C2-R0	ATS	获取价格	High Performance BGA Cooling
ATS-53270B-C1-R0	ATS	获取价格	High Performance BGA Cooling Solutions with m
ATS-53270D-C2-R0	ATS	获取价格	High Performance BGA Cooling

与ATS-53230R-C1-R0相关文章

英伟达新AI芯片Rubin或提前半年亮相
2024-11-05

19
苹果iPhone 17将全系采用三星/LG显示LTPO OLED面板
2024-11-05

17
三星深化印度制造布局，供应链本地化进程加速
2024-10-29

39
芯擎科技“星辰一号”自动驾驶芯片点亮成功，2025年量产在即
2024-10-29

37

产品中心

服务支持

精选活动

关于我们

帮助中心

ATS-53230R-C1-R0

ATS-53230R-C1-R0 数据手册

与ATS-53230R-C1-R0相关器件

与ATS-53230R-C1-R0相关文章

您还可以找

产品中心

服务支持

精选活动

关于我们

帮助中心

ATS-53230R-C1-R0

ATS-53230R-C1-R0 数据手册

与ATS-53230R-C1-R0相关器件

与ATS-53230R-C1-R0相关文章

您还可以找

您在本页遇到什么问题？