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AT25XE081D PDF预览

AT25XE081D

更新时间: 2024-10-29 14:58:07
品牌 Logo 应用领域
瑞萨 - RENESAS /
页数 文件大小 规格书
120页 1896K
描述
8Mbit, 1.65 V to 3.6 V Range SPI Serial Flash Memory with Multi-I/O Support

AT25XE081D 数据手册

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Datasheet  
AT25XE081D  
8-Mbit, 1.65 V - 3.6 V Range SPI Serial Flash Memory with Multi-I/O Support  
Features  
Voltage Range: 1.65 V - 3.6 V  
Erase program suspend resume  
8-Mbit Flash Memory  
Hardware reset option (through the HOLD pin)  
JEDEC hardware reset  
Flexible 256-byte page erase architecture  
Serial Peripheral Interface (SPI) compatible  
• Supports SPI modes 0 and 3  
Low battery detect circuit  
Active interrupt device status capability  
Non-volatile status register configuration option  
• Supports SPI single mode operation (1-1-1)  
• Supports dual output operation (1-1-2)  
• Supports quad output operation (1-1-4)  
JEDEC standard manufacturer and device ID read  
methodology  
Serial Flash Discoverable Parameters (SFDP)  
version 1.6  
• Supports quad XiP operation (1-4-4 and  
0-4-4)  
Low power dissipation:  
133 MHz maximum operating frequency: Clock-to-  
output of 8 ns  
• 30 µA standby current (typical)  
Flexible, optimized erase architecture for code  
and data storage applications  
• 8.5 µA Deep Power-Down (DPD) current  
(typical)  
• Uniform 256-Byte page erase  
• Uniform 4-kByte block erase  
• 7 nA Ultra Deep Power Down (UDPD) current  
(typical)  
• 8.5 mA active read current (1-1-1 — 104 MHz)  
• 8.5 mA program current  
• Uniform 32-kByte block erase  
• Uniform 64-kByte block erase  
• Full chip erase  
• 9.6 mA erase current  
User-configurable and auto I/O pin drive levels  
Endurance: 100,000 program/erase cycles  
Data Retention: 20 years  
Flexible non-volatile block protection  
1 x 128-byte factory-programmed unique identifier  
3 x 128-byte, One Time Programmable (OTP)  
security registers  
-40 oC to +85 oC operation  
Flexible programming  
Industry standard green (Pb/Halide-free/RoHS  
Compliant) Package Options  
• Byte/Page program (1 to 256 Bytes)  
• 8-lead SOIC (150-mil)  
• Single command page buffer direct Read-  
Modify-Write (page write with inclusive erase)  
• 8-lead SOIC (208-mil)  
• Flexible 256-byte SRAM page buffer  
operation  
• 8-pad Ultra-thin DFN (2 x 3 x 0.6 mm)  
• 8-ball WLCSP (3 x 2 x 3 ball matrix)  
• Sequential program mode capability  
• Die/Wafer — Contact Renesas Electronics for  
more information  
Software controlled Reset and Terminate  
commands  
DS-AT25XE081D-147 Rev. K  
2022-08-26  
Page 1  
© 2022 Renesas Electronics  

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