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AS7C33512PFS36A-166TQI PDF预览

AS7C33512PFS36A-166TQI

更新时间: 2024-01-19 13:10:37
品牌 Logo 应用领域
ALSC 内存集成电路静态存储器
页数 文件大小 规格书
19页 542K
描述
3.3V 512K x 32/36 pipelined burst synchronous SRAM

AS7C33512PFS36A-166TQI 技术参数

是否Rohs认证: 不符合生命周期:Transferred
零件包装代码:QFP包装说明:LQFP, QFP100,.63X.87
针数:100Reach Compliance Code:unknown
ECCN代码:3A991.B.2.AHTS代码:8542.32.00.41
风险等级:5.51最长访问时间:3.4 ns
其他特性:PIPELINED ARCHITECTURE最大时钟频率 (fCLK):166 MHz
I/O 类型:COMMONJESD-30 代码:R-PQFP-G100
JESD-609代码:e0长度:20 mm
内存密度:18874368 bit内存集成电路类型:STANDARD SRAM
内存宽度:36功能数量:1
端子数量:100字数:524288 words
字数代码:512000工作模式:SYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:512KX36输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:LQFP
封装等效代码:QFP100,.63X.87封装形状:RECTANGULAR
封装形式:FLATPACK, LOW PROFILE并行/串行:PARALLEL
峰值回流温度(摄氏度):NOT SPECIFIED电源:2.5/3.3,3.3 V
认证状态:Not Qualified座面最大高度:1.6 mm
最小待机电流:3.14 V子类别:SRAMs
最大压摆率:0.3 mA最大供电电压 (Vsup):3.465 V
最小供电电压 (Vsup):3.135 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:Tin/Lead (Sn/Pb)
端子形式:GULL WING端子节距:0.65 mm
端子位置:QUAD处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:14 mmBase Number Matches:1

AS7C33512PFS36A-166TQI 数据手册

 浏览型号AS7C33512PFS36A-166TQI的Datasheet PDF文件第4页浏览型号AS7C33512PFS36A-166TQI的Datasheet PDF文件第5页浏览型号AS7C33512PFS36A-166TQI的Datasheet PDF文件第6页浏览型号AS7C33512PFS36A-166TQI的Datasheet PDF文件第8页浏览型号AS7C33512PFS36A-166TQI的Datasheet PDF文件第9页浏览型号AS7C33512PFS36A-166TQI的Datasheet PDF文件第10页 
AS7C33512PFS32A  
AS7C33512PFS36A  
®
Synchronous truth table[4]  
[2]  
CE01  
H
L
CE1  
X
L
CE2  
X
X
X
H
H
L
ADSP ADSC ADV WRITE  
OE  
X
X
X
X
X
L
Address accessed  
NA  
CLK  
Operation  
Deselect  
DQ  
HiZ  
HiZ  
HiZ  
HiZ  
HiZ  
Q
X
L
L
X
L
X
X
X
X
X
X
X
X
X
L
X
X
X
X
X
X
X
H
H
H
H
H
H
H
H
H
H
L
L to H  
L to H  
L to H  
L to H  
L to H  
L to H  
L to H  
L to H  
L to H  
L to H  
L to H  
L to H  
L to H  
L to H  
L to H  
L to H  
L to H  
L to H  
L to H  
L to H  
L to H  
L to H  
NA  
Deselect  
L
L
H
L
NA  
Deselect  
L
X
X
H
H
H
H
X
X
X
X
X
X
X
X
H
X
X
X
X
X
L
NA  
Deselect  
L
H
L
NA  
Deselect  
L
X
X
L
External  
External  
External  
External  
Next  
Begin read  
L
L
L
H
L
Begin read  
HiZ  
Q
L
L
H
H
H
H
H
H
X
X
X
X
H
H
X
H
X
Begin read  
L
L
L
H
L
Begin read  
HiZ  
Q
X
X
X
X
H
H
H
H
L
X
X
X
X
X
X
X
X
L
H
H
H
H
H
H
H
H
L
Continue read  
Continue read  
Suspend read  
Suspend read  
Continue read  
Continue read  
Suspend read  
Suspend read  
Begin write  
Continue write  
Continue write  
Suspend write  
Suspend write  
L
H
L
Next  
HiZ  
Q
H
H
L
Current  
Current  
Next  
H
L
HiZ  
Q
L
H
L
Next  
HiZ  
Q
H
H
X
L
Current  
Current  
External  
Next  
H
X
X
X
X
X
HiZ  
3
D
X
H
X
H
X
X
X
X
H
H
H
H
L
D
D
D
D
L
L
Next  
H
H
L
Current  
Current  
L
1 X = don’t care, L = low, H = high  
2 For WRITE, L means any one or more byte write enable signals (BWa, BWb, BWc or BWd) and BWE are LOW or GWE is LOW. WRITE = HIGH for all  
BWx, BWE, GWE HIGH. See "Write enable truth table (per byte)," on page 6 for more information.  
3 For write operation following a READ, OE must be high before the input data set up time and held high throughout the input hold time  
4 ZZ pin is always Low.  
12/23/04, v 2.6  
Alliance Semiconductor  
7 of 19  

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