Low Noise & High OIP3
Medium Power Amplifier Module
Features
· S21 = 29.8 dB @ 2300 MHz
Description
The plerowTM APM-Series is an internally matched
amplifier mini-module for such application band in
SMD package with the output P1dB of 29 dBm. It is
compactly designed for low current consumption and
high OIP3. Integrating all the components for biasing
and matching within the module enhances production
yield and throughput as well. It passes through the
stringent DC, RF, and reliability tests. Not sample test
but 100% quality control test is made before packing.
= 28.2 dB @ 2400 MHz
· NF of 2.1 dB over Frequency
· Unconditionally Stable
· Single 5V Supply
· High OIP3 @ Low Current
Specifications (in Production)
Typ. @ T = 25°C, Vs = 5 V, Freq. = 2350 MHz, Zo.sys = 50 ohm
2-stage Single Type
Specifications
Parameter
Unit
Min
2300
28
Typ
Max
2400
Frequency Range
Gain
MHz
dB
29
± 0.8
2.1
More Information
Website: www.asb.co.kr
E-mail: sales@asb.co.kr
Gain Flatness
dB
± 0.9
Noise Figure
dB
2.2
Output IP3 (1)
dBm
dB
44
28
47
S11 / S22 (2)
-18 / -10
Tel: (82) 42-528-7223
Fax: (82) 42-528-7222
Output P1dB
dBm
µsec
mA
V
29
-
ASB Inc., 4th Fl. Venture Town
Bldg., 367-17 Goijeong-Dong,
Seo-Gu, Daejon 302-716, Korea
Switching Time (3)
Supply Current
Supply Voltage
Impedance
1
460
5
500
50
Ω
Max. RF Input Power
Package Type & Size
Operating temperature is -40°C to +85°C.
dBm
mm
C.W 23 ~ 25 (before fail)
Surface Mount Type, 13Wx13Lx3.8H
1) OIP3 is measured with two tones at an output power of 15 dBm / tone separated by 1 MHz.
2) S11/S22 (max) is the worst value within the frequency band.
3) Switching time means the time that takes for output power to get stabilized to its final level after switching DC voltage from 0 V to VS.
Outline Drawing (Unit: mm)
plerow
APM2350-P29
Pin Number
Function
RF In
3
8
RF Out
Vs
ASB Inc.
10
(Top View)
(Bottom View)
Others
Ground
Solder Stencil Area
Note: 1. The number and size of ground via holes in
a circuit board is critical for thermal RF
grounding considerations.
2. We recommend that the ground via holes be
placed on the bottom of all ground pins for
better RF and thermal performance, as
shown in the drawing at the left side.
(Side View)
Ø0.3 plated thru holes to ground plane
2 x Ø2.0 plated thru holes to screw on heat sinker
(Recommended Footprint)
1/5
www.asb.co.kr
February 2009