5秒后页面跳转
AM50DL128BH70IT PDF预览

AM50DL128BH70IT

更新时间: 2024-01-08 20:40:58
品牌 Logo 应用领域
飞索 - SPANSION 闪存
页数 文件大小 规格书
70页 1131K
描述
Two Am29DL640G 64 Megabit (8 M x 8-Bit/4 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memories

AM50DL128BH70IT 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:BGA包装说明:LFBGA,
针数:73Reach Compliance Code:compliant
HTS代码:8542.32.00.71风险等级:5.71
其他特性:PSEUDO STATIC RAM IS ORGANIZED AS 2M X 16; FLASH CAN ALSO BE ORGANIZED AS 8M X 8JESD-30 代码:R-PBGA-B73
JESD-609代码:e0长度:11.6 mm
内存密度:67108864 bit内存集成电路类型:MEMORY CIRCUIT
内存宽度:16湿度敏感等级:3
功能数量:1端子数量:73
字数:4194304 words字数代码:4000000
工作模式:ASYNCHRONOUS最高工作温度:85 °C
最低工作温度:-40 °C组织:4MX16
封装主体材料:PLASTIC/EPOXY封装代码:LFBGA
封装形状:RECTANGULAR封装形式:GRID ARRAY, LOW PROFILE, FINE PITCH
峰值回流温度(摄氏度):240认证状态:Not Qualified
座面最大高度:1.4 mm最大供电电压 (Vsup):3.3 V
最小供电电压 (Vsup):2.7 V标称供电电压 (Vsup):3 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:TIN LEAD
端子形式:BALL端子节距:0.8 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:30
宽度:8 mmBase Number Matches:1

AM50DL128BH70IT 数据手册

 浏览型号AM50DL128BH70IT的Datasheet PDF文件第2页浏览型号AM50DL128BH70IT的Datasheet PDF文件第3页浏览型号AM50DL128BH70IT的Datasheet PDF文件第4页浏览型号AM50DL128BH70IT的Datasheet PDF文件第5页浏览型号AM50DL128BH70IT的Datasheet PDF文件第6页浏览型号AM50DL128BH70IT的Datasheet PDF文件第7页 
Am50DL128BH  
Data Sheet  
July 2003  
The following document specifies Spansion memory products that are now offered by both Advanced  
Micro Devices and Fujitsu. Although the document is marked with the name of the company that orig-  
inally developed the specification, these products will be offered to customers of both AMD and  
Fujitsu.  
Continuity of Specifications  
There is no change to this datasheet as a result of offering the device as a Spansion product. Any  
changes that have been made are the result of normal datasheet improvement and are noted in the  
document revision summary, where supported. Future routine revisions will occur when appropriate,  
and changes will be noted in a revision summary.  
Continuity of Ordering Part Numbers  
AMD and Fujitsu continue to support existing part numbers beginning with “Am” and “MBM. To order  
these products, please use only the Ordering Part Numbers listed in this document.  
For More Information  
Please contact your local AMD or Fujitsu sales office for additional information about Spansion  
memory solutions.  
Publication Number 30773 Revision A Amendment +3 Issue Date February 6, 2004  

与AM50DL128BH70IT相关器件

型号 品牌 获取价格 描述 数据表
AM50DL128BH85FS SPANSION

获取价格

Memory Circuit, 4MX16, CMOS, PBGA73, 8 X 11.60 MM, FBGA-73
AM50DL128BH85FT SPANSION

获取价格

Memory Circuit, 4MX16, CMOS, PBGA73, 8 X 11.60 MM, FBGA-73
AM50DL128BH85I AMD

获取价格

Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM50DL128BH85IS SPANSION

获取价格

Two Am29DL640G 64 Megabit (8 M x 8-Bit/4 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Oper
AM50DL128BH85IS AMD

获取价格

Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM50DL128BH85IT SPANSION

获取价格

Two Am29DL640G 64 Megabit (8 M x 8-Bit/4 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Oper
AM50DL128BH85IT AMD

获取价格

Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM50DL128CG AMD

获取价格

64 Megabit (4 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memories and 64
AM50DL128CG SPANSION

获取价格

Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM50DL128CG70FS SPANSION

获取价格

Memory Circuit, 8MX16, CMOS, PBGA88, 11.60 X 8 MM, FBGA-88